A kind of LED encapsulation method
A technology of LED packaging and packaging method, which is applied to semiconductor devices, electrical components, circuits, etc., can solve problems such as affecting the processing effect of LED lamp holders, affecting the working efficiency of wire bonding machines, and wear of working end sidewalls, etc., and achieves accelerated heating and melting. Efficiency, enhance the overall use effect, and ensure the effect of accuracy
Active Publication Date: 2021-02-19
深圳市华皓伟业光电有限公司
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Problems solved by technology
[0004] In order to make up for the deficiencies of the existing technology and solve the problem of blockage of the wire bonding machine, during the wire bonding process of the LED light frame, if the cooling time of the wire bonding machine is long in the middle, the working end of the wire bonding machine will appear gold wire cooling Afterwards, it will cause blockage, which seriously affects the working efficiency of the wire bonding machine, and requires the staff to manually clean the working end of the wire bonding machine. During the cleaning process, the side wall of the working end is easily worn, thus damaging the gold wire. The control of the diameter has a serious impact, which further affects the overall processing effect of the LED lamp holder. The present invention proposes a LED packaging method
Method used
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[0034] As an embodiment of the present invention, the outer wall of the first plate 751 is provided with a first baffle 754; the second plate 752 is provided with a second baffle 755 on the outer wall close to the semicircular plate 753, and the second plate 752 is slidingly connected with load-bearing blocks 756 on the outer walls of the first block 754 and the second block 755. The load-bearing blocks 756 all have the same magnetism, and the second plate 752 is provided with shrapnel at the hinge with the first plate 751 757, so that when the hot-melt adhesive is solid, the hot-melt adhesive lifts the shrapnel 757 to contact with the inner wall of the load-bearing block 756; through the cooperation of the first block 754, the second block 755, the load-bearing block 756 and the elastic 757 to ensure When working, when the No. 1 plate 751 drives the No. 2 plate 752 to rotate, the hot melt adhesive is still in a solid state. At this time, the hot melt adhesive generates a force...
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The invention belongs to the technical field of semiconductor production and processing, and specifically relates to an LED packaging method; the wire bonding machine used in the packaging method includes a base, a support frame, a backing plate, a power distribution cabinet, a fixing plate, a mechanical arm and a ceramic nozzle; The heating unit is installed on the outer wall of the delivery pipe, and the heating unit includes a V-shaped plate, a heating ring and a cylinder; through the base, the support frame, the padding board, the power distribution cabinet, the fixing plate, the mechanical arm and the ceramic nozzle, the LED The light frame realizes the welding wire processing; realizes the effect of rushing the gold wire at the inlet, accelerates the heating and melting efficiency of the gold wire, and makes the gold wire flow out through the outlet after melting, so as to realize the dredging effect on the ceramic nozzle, and in dredging The inner wall of the ceramic nozzle will not be scratched during the process, which ensures the accuracy of the working diameter of the ceramic nozzle, thereby further enhancing the overall use effect of the wire bonding machine.
Description
technical field [0001] The invention belongs to the technical field of semiconductor production and processing, in particular to an LED packaging method. Background technique [0002] LED (semiconductor light-emitting diode) packaging refers to the packaging of light-emitting chips, which is quite different from integrated circuit packaging. The packaging of the LED is not only required to be able to protect the wick, but also to be able to transmit light. Therefore, LED packaging has special requirements for packaging materials. LED packaging technology is mostly developed and evolved on the basis of discrete device packaging technology, but it has great particularity. The function of the package is to provide enough protection for the chip to prevent the chip from failing due to long-term exposure in the air or mechanical damage, so as to improve the stability of the chip; for LED packages, it is also necessary to have good light extraction efficiency and good heat dissi...
Claims
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IPC IPC(8): H01L33/48H01L33/52H01L33/62H01L25/075
CPCH01L25/0753H01L33/486H01L33/52H01L33/62H01L2933/0033H01L2933/005H01L2933/0066
Inventor 朱辉
Owner 深圳市华皓伟业光电有限公司