Silver paste heating device for pasting integrated chip
A technology of integrating chips and heating devices, which is applied in electric heating devices, heat treatment equipment, electrical components, etc., can solve the problem of long time consumption for rewarming and liquefaction of silver paste, and achieve the effect of shortening time and speeding up efficiency.
Active Publication Date: 2020-07-14
郑玲佳
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- Description
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- Application Information
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Problems solved by technology
In the pasting process of the chip, the liquefied silver paste needs to be dotted on the pad first, and then the chip is dotted on the pad with the silver paste attached; and the silver paste before the paste is generally stored in a solid storage tube and then stored in the tube , when using silver paste, it is necessary to return to temperature and liquefy; the existing silver paste liquefaction uses a heating device to directly heat the silver paste in the storage tube, but it takes a long time to return to temperature and liquefy the silver paste, and it needs to be able to process the silver paste to return to temperature liquefied heating device
Method used
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Embodiment Construction
[0023] Example: see Figures 1 to 4 As shown, a silver paste heating device for integrated chip bonding includes a circular heating container 1, a fixed ring 2 is fixed on the inner wall of the heating container 1, and the upper end surface of the fixed ring 2 is against an outer ring gear 3. A connecting sleeve 33 is formed on the lower end surface of the ring gear 3, and the connecting sleeve 33 passes through the fixed ring 2 to fix the limit sleeve 4. One side of the fixed ring 2 is formed with a support plate 21, and the upper side of the support plate 21 is provided with The gear 6, the gear 6 meshes with the outer ring gear 3, the gear 6 is plugged and fixed on the rotating shaft of the motor 7, the motor 7 is fixed on the heating container 1, and the upper end surface of the outer ring gear 3 is against the seat 5 ;
[0024] The storage seat 5 includes an annular top plate 51, the lower end surface of the top plate 51 is formed with a connecting pipe 52 communicating ...
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The invention discloses a silver paste heating device for pasting an integrated chip. The heating device comprises a circular heating container, and a fixed ring is fixed on the inner wall of the heating container; the upper end face of the fixed ring abuts against an outer gear ring. A connecting sleeve is formed on the lower end face of the outer gear ring, the connecting sleeve penetrates through the fixing ring to be fixedly sleeved with a limiting sleeve, a supporting plate is formed on one side of the fixing ring, a gear is arranged on the upper side of the supporting plate and meshed with the outer gear ring, the gear is fixedly sleeved with a rotating shaft of a motor, the motor is fixed to the heating container, and a containing base abuts against the upper end face of the outer gear ring. According to the closed heating container provided by the invention, the heat circulation can be carried out in the heating container, and the silver paste storage pipe in the heating container is subjected to the action of centrifugal force, so the temperature returning liquefaction efficiency of silver paste can be improved, and the time required by silver paste liquefaction can be shortened.
Description
technical field [0001] The invention relates to the technical field of chip packaging devices, in particular to a silver paste heating device for pasting integrated chips. Background technique [0002] At present, the chip packaging process includes chip bonding, silver paste curing, lead welding, light inspection, injection molding, laser typing, high temperature curing, flash removal, electroplating annealing, rib trimming and so on. In the pasting process of the chip, the liquefied silver paste needs to be dotted on the pad first, and then the chip is dotted on the pad with the silver paste attached; and the silver paste before the paste is generally stored in a solid storage tube and then stored in the tube , when using silver paste, it is necessary to return to temperature and liquefy; the existing silver paste liquefaction uses a heating device to directly heat the silver paste in the storage tube, but it takes a long time to return to temperature and liquefy the silve...
Claims
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Patent Timeline
Login to View More IPC IPC(8): H01B13/00H05B1/00H05B1/02
CPCH01B13/0016H05B1/00H05B1/0233
Inventor 徐俊
Owner 郑玲佳