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Film coating and rubberizing equipment for semiconductor chip

A semiconductor and adhesive technology, applied in the field of coating and adhesive equipment for semiconductor chips, can solve the problems of crooked adhesive, poor adhesive quality, low efficiency, etc., to achieve high yield, reduce the demand for human resources, and improve the overall effect of benefit

Pending Publication Date: 2020-07-14
HIMIT (SHENZHEN) TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

What needs to be known is that there are many problems in manual operation, such as low efficiency, poor quality of glue application, easy to apply crooked glue, which directly affects the coating quality of the chip, and manual operation needs to recruit a lot of workers, which is also harmful to the economic benefits of the enterprise. great influence

Method used

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  • Film coating and rubberizing equipment for semiconductor chip
  • Film coating and rubberizing equipment for semiconductor chip
  • Film coating and rubberizing equipment for semiconductor chip

Examples

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Embodiment Construction

[0028] It should be understood that the specific embodiments described herein are only used to explain the present invention, but not to limit the present invention.

[0029] Reference Figure 1-Figure 3 , A coating and glueing equipment for semiconductor chips, including a machine 100. The machine 100 is sequentially provided with a loading bin 200, a loading device 500, a bottom film tearing device 400, a glue transfer device 700, and a film tearing device 800 ;

[0030] After the loading device 500 takes out the blue glue from the loading bin 200, it tears off the bottom film of the blue glue through the bottom film tearing device 400, and then pastes the blue glue from the bottom film on the coating film placed on the glue transfer device 700 On the jig, the coating jig is transferred to the film tearing device 800 through the pressure glue transfer device 700, after the film is removed, and then transferred out of the equipment.

[0031] Furthermore, refer to figure 1 A bottom...

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Abstract

The invention discloses coating and rubberizing equipment for a semiconductor chip. The equipment comprises a machine table; a feeding bin, a feeding device, a bottom film tearing device, a rubberizing transfer device and an upper film tearing device which are sequentially arranged on the machine table. After the feeding device takes out blue glue from the feeding bin, a bottom film of the blue glue is torn off through the bottom film tearing device, then the blue glue with the bottom film torn off is attached to the film coating jig placed on the glue pressing transferring device, and the film coating jig is transferred to the upper film tearing device through the glue pressing transferring device, tears off the upper film and then is transferred out of the equipment. Due to the adoptionof the full-automatic design, the original manual film sticking work is automated, and the requirement for high-speed production is met; compared with manual operation, the equipment is higher in yield of automatic film tearing and adhesive sticking, reduces the requirements for human resources, and improves the overall benefits of enterprises.

Description

Technical field [0001] The invention relates to automation equipment, in particular to a coating and glueing equipment for semiconductor chips. Background technique [0002] Semiconductor chips need to be coated during the production process. The general coating process uses sputtering, also called vacuum coating. Before the semiconductor chip is sent to the coating equipment, the chip needs to be pasted on the chip coating jig. After the blue glue is pasted on the fixture, the glue is compacted, and then the chip is pasted. The blue glue is a double-sided adhesive with release films on both sides. [0003] In the traditional process, the application of glue to the chip coating jig needs to be done manually. Workers use both hands to stick the double-sided tape on the jig, and then use a manual laminator to hold the glue on the jig. Ensure that the glue and the fixture are firmly pasted. What you need to know is that there are many problems with manual operation, such as low effi...

Claims

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Application Information

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IPC IPC(8): H01L21/67H01L21/677H01L21/683
CPCH01L21/67132H01L21/6836H01L21/67259H01L21/67706H01L21/67742H01L2221/68313
Inventor 蒋海兵
Owner HIMIT (SHENZHEN) TECH CO LTD
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