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A kind of copper-clad or copper-clad aluminum oxide ceramic substrate and preparation method thereof

A technology of alumina ceramics and copper alloys, applied in metal material coating process, coating, melting spray plating, etc., can solve the problems of high cost, difficult production, large equipment investment, etc., and achieve low cost and high utilization rate of raw materials , the effect of excellent coating performance

Active Publication Date: 2021-10-26
TSINGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The main advantage of the thin film method is that the metal layer is uniform and the bonding strength is high, but the disadvantages are that the equipment investment is large, the production is difficult, and the cost is high
However, this method has extremely strict temperature control, and subsequent annealing and deoxidation processing of the copper clad layer is required.

Method used

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  • A kind of copper-clad or copper-clad aluminum oxide ceramic substrate and preparation method thereof
  • A kind of copper-clad or copper-clad aluminum oxide ceramic substrate and preparation method thereof
  • A kind of copper-clad or copper-clad aluminum oxide ceramic substrate and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0086] In this embodiment, copper is deposited on the surface of alumina ceramics according to the following steps to prepare an alumina ceramic circuit board.

[0087] (1) Add metal copper powder with an average particle size of 30 microns into the atmospheric plasma spraying feeding system, and turn on the argon gas switch. Turn on the main switch, power switch, gas switch, air compressor and vacuum cleaner switch of the spraying equipment in turn, and set the operation program to make the cooling water run. Install specified tungsten electrodes and custom powder plasma torches (eg figure 2 Shown in middle a, cooling air nozzle is not shown), produces plasma beam outside spray gun nozzle;

[0088] (2) Clean the alumina ceramic substrate with a surface roughness of about 3 μm in alcohol and acetone to remove organic matter and impurities on the surface, and then fix it on the workbench;

[0089] (3) The spraying process parameters are set, the spraying start coordinates (X=...

Embodiment 2

[0093] (1) Add metal copper powder with an average particle size of 30 microns into the atmospheric plasma spraying feeding system, and turn on the argon gas switch. Turn on the main switch, power switch, gas switch, air compressor and vacuum cleaner switch of the spraying equipment in turn, and set the operation program to make the cooling water run. Install specified tungsten electrodes and custom powder plasma torches (eg figure 2 As shown in a, the cooling gas nozzle is not shown), and the plasma beam is generated outside the nozzle of the spray gun.

[0094] (2) Clean the alumina ceramic substrate with a surface roughness of about 3 μm in alcohol and acetone to remove organic matter and impurities on the surface, and then fix it on the workbench.

[0095](3) Set the spraying process parameters, the spraying start coordinates (X=0mm, Y=0mm), the end coordinates (X=40mm, Y=40mm), the spraying current is 150A, the distance from the plasma spray gun mouth to the ceramic subs...

Embodiment 3

[0099] (1) Add copper powder with an average particle size of 50 microns into the atmospheric plasma spraying feeding system, and turn on the argon-hydrogen mixture gas switch, and the hydrogen content is 5% by volume. Turn on the main switch, power switch, gas switch, air compressor and vacuum cleaner switch of the spraying equipment in turn, and set the operation program to make the cooling water run. Install specified tungsten electrodes and custom powder plasma torches (eg figure 2 Shown in middle a, cooling air nozzle is not shown), produces plasma beam outside spray gun nozzle;

[0100] (2) Clean the alumina ceramic substrate with a surface roughness of about 3 μm in alcohol and acetone to remove organic matter and impurities on the surface, and then fix it on the workbench.

[0101] (3) Set the spraying process parameters, the spraying start coordinates (X=0mm, Y=0mm), the end coordinates (X=40mm, Y=40mm) the spraying current is 150A, the distance from the plasma spray...

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Abstract

A copper-clad or copper-clad alloy alumina ceramic substrate and a preparation method thereof. The preparation method selects metal copper or copper alloy powder, and sprays the metal copper or copper alloy powder on the surface of an alumina ceramic substrate covered with a specific pattern mask by atmospheric plasma spraying technology in a molten state, and adjusts many process parameters and The plasma spray gun structure prepares the alumina ceramic copper-clad substrate with high interface bonding strength and high electrical conductivity between copper or copper alloy and alumina ceramic. The present invention directly sprays metal copper or copper alloy powder on the alumina ceramic substrate to obtain a copper-clad ceramic substrate, and sprays metal copper or copper alloy powder on the alumina ceramic substrate coated with a mask of a circuit pattern to obtain different patterns and Copper-clad circuit ceramic substrate with high line width accuracy. The invention relates to a new copper-clad or copper-alloy alumina ceramic substrate and a preparation method. The method is simple, can realize rapid and large-area preparation, reduces costs, and has broad application prospects.

Description

technical field [0001] The invention relates to an alumina ceramic substrate, in particular to a copper-clad or copper-clad alloy alumina ceramic substrate and a preparation method thereof. Background technique [0002] Ceramic metallization is a key process in current electronic device packaging technology. Among them, alumina ceramics have high mechanical strength, good insulation performance, low dielectric loss, etc., and their bending strength is greater than or equal to 300MPa, and are widely used in microelectronic packaging. The metallization molding process of alumina ceramic substrate is an important factor restricting its application. [0003] At present, the mainstream metallized alumina ceramic substrate technology is the Mo-Mn method, the direct copper clad method (DBC), and the thin film method (DPC). The Mo-Mn method is based on heat-resistant metal Mo powder, adding Mn powder, and printing on the surface of alumina ceramic substrate by screen printing, and...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C04B41/88C23C4/08C23C4/134
CPCC04B41/009C04B41/5127C04B41/88C23C4/08C23C4/134C04B41/4527C04B35/10
Inventor 潘伟刘广华
Owner TSINGHUA UNIV
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