Solar cell cutting and passivating integrated processing method and solar cell
A technology of solar cells and processing methods, applied in electrolytic capacitors, electric solid devices, sustainable manufacturing/processing, etc., can solve the problems of good coverage of P3 grooves, unstable effect, difficulty in adding protective layers, etc. The effect of fast process, saving production time, and guaranteeing the accuracy of deposition position
Active Publication Date: 2020-07-28
HANGZHOU MICROQUANTA SEMICON CO LTD
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Problems solved by technology
Moreover, it is difficult for the protective layer material to enter the groove of P3, and cannot completely and well cover the groove of P3, the effect is unstable, and it is very difficult to realize the addition of a protective layer
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[0021] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
[0022] Please also refer to image 3 as well as Figure 4 As shown, the solar cell cutting and passivation integrated processing method of the present invention and a preferred embodiment of the solar cell thereof, the solar cell includes a substrate 1, a front electrode layer 2, a light-absorbing layer 3 and a back electrode layer 4 sequentially from bottom to top . The substrate 1 is arranged at the bottom, and the back electrode layer 4 is arranged at the top.
[0023] Before performing laser structured cutting on the back electrode layer 4, a protective laye...
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Abstract
The invention relates to a solar cell cutting and passivating integrated processing method. The solar cell comprises a substrate, a front electrode layer, a light absorption layer and a back electrodelayer. Before the back electrode layer is subjected to laser structured cutting, a protective layer is arranged on the surface of the back electrode layer; laser structured cutting is performed on the back electrode layer or is simultaneously performed on the back electrode layer and the light absorption layer through the protective layer to obtain corresponding structured grooves; and the protective layer is reserved and not cut by laser, and the material of the protective layer is partially melted and infiltrated into the corresponding structured groove below due to local high temperature generated by laser processing in the laser structured cutting process. The invention further discloses a solar cell prepared by using the method. According to the invention, the groove which is just processed is passivated while laser cutting processing is carried out, the production cost is reduced, the processing time is saved, and the edge of the cut groove is repaired, so that the morphology ofthe processed groove is improved, the stability of the cell is improved, and the service life of the cell is prolonged.
Description
technical field [0001] The invention belongs to the technical field of solar cell processing and preparation, and in particular relates to a solar cell cutting and passivation integrated processing method and the solar cell. Background technique [0002] In the existing solar cell manufacturing process, laser cutting is commonly used to process solar cell components. Commonly used laser cutting processing methods are mainly divided into three steps, and each step processes a structured groove, or processing line, referred to as three processing lines P1, P2, and P3, such as figure 1 and figure 2 shown. The three processing lines are arranged in sequence, from P1 to P3 are the dead zone of the solar cell, among which, the P1 processing line mainly cuts off the front electrode layer A, and mainly laser-processes structured grooves on the front electrode layer A, and the P2 processing line mainly Cut off the light-absorbing layer B, and mainly laser process another set of...
Claims
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IPC IPC(8): H01L31/18H01L21/304H01L31/04H10K99/00
CPCH01L31/1868H01L31/1876H01L21/3043H01L31/04H10K30/50H01L31/0463H10K30/57Y02P70/50H10K39/12H01G9/2009H10K71/621H10K30/88H10K30/451
Inventor 不公告发明人
Owner HANGZHOU MICROQUANTA SEMICON CO LTD