Failure Analysis Methods for Semiconductor Devices

Abstract

The present invention provides a failure analysis method for a semiconductor device. The failure analysis method for a semiconductor device includes: performing an electrical failure analysis on the semiconductor device to locate a certain failed conductive line; Perform hot spot capture on the failed conductive line to locate the hot spot; if the hot spot in the certain failed conductive line is not captured, repair the certain failed conductive line to fix the certain failed conductive line A failed conductive circuit is exposed, and then the hot spot in the exposed failed conductive circuit is captured for the next step of physical failure analysis. The technical solution of the present invention enables hot spots to be caught even when product design changes, thereby enabling fast and accurate finding of defect locations and analysis of failure causes, thereby realizing improvement of failed products.

Description

technical field [0001] The invention relates to the field of integrated circuit manufacturing, in particular to a failure analysis method of a semiconductor device. Background technique [0002] Electrical Failure Analysis (EFA, Electrical Failure Analysis) is a failure analysis based on electrical measurement, and its main purpose is to determine the test structure that fails in the chip. Electrical failure analysis is based on functional testing. By providing electrical test signals for the chip and analyzing whether the electrical test results conform to the theoretical analysis, the faulty test structure is determined. Physical Failure Analysis (PFA, Physical Failure Analysis) is to obtain the line width, thickness, composition and other values ​​of the test structure in the test chip according to the requirements. In many cases, it is necessary to observe the location of the defect by slicing to determine the specific location of the defect. . [0003] Among them, whe...

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Problems solved by technology

[0004] However, in the actual production process, due to different product designs, it often happens that the electrical test program used in conjunction with the EMMI machine cannot access the inside of a failed word line or bit line, resulting in the failure of the EMMI machine to catch The hot spot is taken, so that the failure cause cannot be found through further physical failure analysis, and the failed product cannot be improved.

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