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Intelligent cabin host

A cockpit and host technology, which is used in the screening of casings, cooling/ventilation/heating transformation, electrical components, etc., can solve the problems of unsuitable IC power supply systems, poor shielding ability of the cockpit host, and poor dustproof and moisture-proof effects. Increase dustproof and moistureproof ability, good dustproof and moistureproof effect, good heat dissipation effect

Pending Publication Date: 2020-08-04
HUIZHOU DESAY SV AUTOMOTIVE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The existing intelligent cockpit host is not suitable for power systems with high IC power due to uneven heat dissipation, high temperature in some areas, and easy circuit burnout. Moreover, the general cockpit host has poor shielding ability and poor dustproof and moisture-proof effect

Method used

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Embodiment Construction

[0024] The specific embodiments of the present invention will be further described below in conjunction with the accompanying drawings. It should be noted here that the description of the following embodiments is used to help understand the invention, but does not constitute a limitation to the present invention.

[0025] Figure 1-3 It shows a smart cockpit host disclosed in the present invention, including a main board 1 and a middle frame 2 arranged below the main board 1. 2. The heat dissipation end 3 on both sides and the fixed end 4 located in the concave part of the middle frame 2. There is a support plane 5 between one side of the fixed end 4 and the heat dissipation end 3. The smart cockpit host also includes a corresponding fixed end 4 set on the middle frame. 2. The bracket covers 6 on both sides, the heat dissipation ends 3 on both sides of the middle frame 2 are each embedded with a heat sink 7, and the fixed end 4 is provided with a number of ratchet slots 8.

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PUM

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Abstract

The invention relates to an intelligent cabin host. The host comprises a main board and a middle frame arranged under the main board, the middle of the middle frame is concave inwards, and the two sides of the middle frame are jacked up to be support-shaped. The middle frame comprises heat dissipation ends located at the two sides of the middle frame and a fixed end located on the inwards-concaveportion of the middle frame. A supporting plane is reserved between one side of the fixed end and the heat dissipation end. The intelligent cabin host further comprises support covers arranged at thetwo sides of the middle frame corresponding to the fixed end, cooling fins are embedded in the heat dissipation ends on the two sides of the middle frame, and a plurality of ratchet grooves are formedin the fixed end. A circular positioning groove is further formed in the cooling fin, a plurality of positioning holes are further formed in the middle frame, and the support cover comprises a supporting plate connected with the fixed end and connecting claws arranged on the two sides of the supporting plate and fixed to the cooling fins through the circular positioning groove. The intelligent cabin host is uniform in heat dissipation, high in shielding capacity, good in dustproof and moisture-proof effect and high in IC power.

Description

technical field [0001] The invention relates to the field of automobile cockpits, in particular to an intelligent cockpit host. Background technique [0002] The smart cockpit system integrates driving and the car, and controls the driving environment and in-car information through different visual modes. Driving information is conveyed by on-board sensors and multimedia channels. While enjoying a variety of entertainment, it can also stay connected at any time to ensure the driving safety of drivers and passengers. [0003] The existing smart cockpit hosts are not suitable for power systems with high IC power due to uneven heat dissipation, high temperature in some areas, and easy circuit burnout. Moreover, the general cockpit hosts have poor shielding ability and poor dust and humidity protection. Contents of the invention [0004] The technical problem to be solved by the present invention is to provide an intelligent cockpit host with uniform heat dissipation, strong ...

Claims

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Application Information

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IPC IPC(8): H05K7/20H05K5/00H05K9/00
CPCH05K5/0056H05K7/20854H05K9/0007
Inventor 曾日荣黄传明黄金章曾健黄思滔
Owner HUIZHOU DESAY SV AUTOMOTIVE