Low-temperature co-fired ceramic raw material belt and preparation method thereof

A technology of low-temperature co-fired ceramics and raw material tape, which is applied in the field of low-temperature co-fired ceramics, can solve the problems of large sintering shrinkage rate and the like, and achieve the effect of good matching.
CN111499394AInactive Publication Date: 2020-08-07上海晶材新材料科技有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
上海晶材新材料科技有限公司
Publication Date
2020-08-07
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention provides a low-temperature co-fired ceramic raw material belt and a preparation method thereof. The preparation method comprises the following steps: mixing first ceramic powder and BS glass powder to obtain ceramic-glass mixed powder, and forming ceramic-glass mixed slurry based on the ceramic-glass mixed powder; preparing ceramic slurry based on the second ceramic powder; and forming a lower material layer on the surface of the base film based on the ceramic glass mixed slurry, forming an intermediate material layer on the surface of the lower material layer based on the ceramic slurry, and forming an upper material layer on the surface of the intermediate material layer based on the ceramic glass mixed slurry to prepare the raw material belt. According to the invention, the problem of large sintering shrinkage rate in the X-axis direction and the Y-axis direction after the existing LTCC raw material belt material is sintered is solved.
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Description

technical field

[0001] The invention relates to the field of low-temperature co-fired ceramics, in particular to a low-temperature co-fired ceramic raw belt and a preparation method thereof. Background technique

[0002] Low-temperature cofired ceramics (LTCC) technology refers to making low-temperature sintered ceramic powder into a precise and dense raw tape as a circuit substrate material. hole grouting, precision conductor paste printing and other processes to produce the required circuit pattern, and embed multiple passive components in it, and then stack them together for sintering to make a passive integrated component of a three-dimensional circuit network or a built-in passive component. The three-dimensional circuit substrate of the source component is made into a passive / active integrated functional module by mounting IC and active devices on its surface. LTCC technology is easy to realize the integrated structure of multi-layer wiring and packaging, which can re...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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