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A Broadband Absorptive Band-Stop Filter Chip Based on Thin Film IPD Technology

A band-stop filter and wide-band technology, applied in impedance networks, electrical components, single-ended pair networks, etc., can solve the problems of large device thickness, increased cost, and large size, and achieve fewer substrate layers and reduced volume , the effect of small thickness

Active Publication Date: 2022-02-08
BEIJING UNIV OF POSTS & TELECOMM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The purpose of the embodiments of the present invention is to provide a wide-band absorption band-stop filter chip based on thin-film IPD technology, which is used to solve the problem that the absorption band-stop filter in the prior art has narrow-band band-stop characteristics, and the device has a large thickness and a large size. Large and technical problems that increase in cost with device thickness

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  • A Broadband Absorptive Band-Stop Filter Chip Based on Thin Film IPD Technology
  • A Broadband Absorptive Band-Stop Filter Chip Based on Thin Film IPD Technology
  • A Broadband Absorptive Band-Stop Filter Chip Based on Thin Film IPD Technology

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Embodiment Construction

[0044] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0045] First of all, in order to facilitate the understanding of the embodiments of the present invention, here we first introduce the terms "first MIM capacitor", "second MIM capacitor", "third MIM capacitor" and "fourth MIM capacitor" used in the context of the embodiments of the present invention. ", "Fifth MIM Capacitor", "First Direct Spiral Inductor", "Second Direct Spiral Inductor", "Third Direct Spiral Inductor", "First Crossed Spiral Inductor", "Second...

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Abstract

An embodiment of the present invention provides a wide-band absorption band-stop filter chip based on thin-film IPD technology, which includes: a base layer of a single-layer dielectric board and a thin-film integrated passive device IPD technology generated on the dielectric board Absorptive band-rejection filter circuit; Absorptive band-rejection filter circuit includes: input port, output port, basic band-rejection main road connected between the input port and output port, and broadband broadband connected to the basic band-rejection main road Absorption branch; input port, used to receive the input signal; basic band-stop main circuit, used to block the signal in the band-stop frequency range; broadband absorption branch, used to absorb the signal and expand the band of the signal The frequency range of the rejection; the output port is used to output signals other than the frequency range of the band rejection after the signals are processed by the broadband absorption branch and the basic band rejection main circuit.

Description

technical field [0001] The invention relates to the field of integrated circuits, in particular to a wide-band absorption band-stop filter chip based on thin-film IPD technology. Background technique [0002] With the rapid development of wireless communication technology, the spectrum resources are becoming more and more complex, and the band-stop filter is gradually developing towards the trend of broadband, low insertion loss, and ultra-miniaturization. The absorbing band-stop filter in the band-stop filter can directly absorb some interference signal frequency components in the input signal through resistance absorption to achieve the interference signal suppression function. [0003] In recent years, a large number of absorptive band-stop filters have been developed in various ways in the prior art. In one way, low temperature co-fired ceramic (Low Temperature Cofired Ceramic, LTCC for short) technology can be used. Generally, the prior art utilizes LTCC technology to ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H03H5/12
CPCH03H5/12
Inventor 吴永乐孔梦丹庄正王卫民
Owner BEIJING UNIV OF POSTS & TELECOMM