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Expanding apparatus

A technology of expansion device and expansion sheet, which is applied in the field of expansion device, can solve the problems of difficult cooling, large-scale expansion device, and the inability to ignore the cooling cost of expansion sheet, etc., and achieve the effect of simple structure

Pending Publication Date: 2020-08-14
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] If the cooling chamber is assembled in the extension, it will make the extension larger
Moreover, it is not easy to cool the inner space of the cooling chamber with a large capacity in order to reliably cool the extension sheet, and the cooling cost of the extension sheet cannot be ignored.

Method used

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  • Expanding apparatus
  • Expanding apparatus
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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0030] Embodiments of the present invention will be described with reference to the drawings. The expanding device of the present embodiment expands the expanding piece of the workpiece unit in which the workpiece, the expanding piece, and the ring frame are integrated. figure 2 etc. show the cross section of the workpiece unit 11 .

[0031] The expansion sheet 7 included in the workpiece unit 11 includes, for example, a base material layer made of vinyl chloride or the like, and a paste layer supported by the base material layer. The central region of one surface of the expansion sheet 7 is stuck to the workpiece 1 . In addition, the outer peripheral portion of the expansion sheet 7 is attached to the inner peripheral portion of the annular frame 9 having an opening so as to seal the opening.

[0032] The workpiece 1 is, for example, a wafer made of materials such as silicon, SiC (silicon carbide), or other semiconductors, or a substantially disk-shaped substrate made of m...

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PUM

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Abstract

The invention provides an expanding device which cools an expansion sheet with a simpler structure. The expanding device expands an expansion piece of a workpiece unit including a workpiece, the expansion piece, and an annular frame to which the outer peripheral side of the expansion piece is adhered. The expanding device comprises: a frame fixing unit having a frame support part and a frame pressing part, the frame fixing unit being configured to fix the expansion piece to the workpiece, wherein the frame supporting part can support an annular frame of a to-be-processed object unit, and the frame pressing part can clamp the annular frame together with the frame supporting part; and an expansion unit capable of expanding the expansion sheet, the frame fixing unit having an ejection port and a cooling air supply path, one end of the cooling air supply path communicating with the ejection port and the other end communicating with a cooling air supply source, wherein the discharge port iscapable of discharging cooling air supplied from the cooling air supply source toward a region between a workpiece of an expansion piece included in a workpiece unit and an inner peripheral edge of the annular frame.

Description

technical field [0001] The present invention relates to an expansion device that expands an expansion piece attached to an annular frame on its outer peripheral side radially outward. Background technique [0002] After setting a plurality of intersecting planned dividing lines (also called lanes) on the front surface of a disk-shaped wafer and forming devices in each area divided by the planned dividing lines, when the wafer is divided along the planned dividing lines , each device chip can be formed. The formed device chip is mounted and used in electronic equipment or the like. [0003] Dividing of the wafer is performed using, for example, a laser processing device. For example, a laser beam having a wavelength that is transparent to the wafer is condensed inside the wafer along a planned dividing line to form a modified layer as a starting point for dividing along the planned dividing line. [0004] A sheet called an expansion sheet is pasted on the back side of the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/687
CPCH01L21/67017H01L21/67109H01L21/68785H01L21/67132H01L21/6836H01L21/67092
Inventor 松田智人川口吉洋
Owner DISCO CORP