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Grinding pad finishing unit and device

A dressing device and polishing pad technology, applied in abrasive surface conditioning devices, grinding/polishing equipment, grinding machine parts, etc., can solve problems such as scratches or defects on the surface of silicon wafers, and reduce scratches and defects. chance, reduced chance of scratches and defects, effect of good cleaning

Inactive Publication Date: 2020-08-25
INST OF MICROELECTRONICS CHINESE ACAD OF SCI +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the ability to clean the grinding slag on the polishing pad is insufficient, the grinding slag will accumulate in the pores or lines, and the accumulated grinding slag will easily cause scratches or defects on the surface of the polished silicon wafer during the subsequent grinding process

Method used

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  • Grinding pad finishing unit and device
  • Grinding pad finishing unit and device

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Embodiment Construction

[0022] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. It should be understood, however, that these descriptions are exemplary only, and are not intended to limit the scope of the present disclosure. Also, in the following description, descriptions of well-known structures and techniques are omitted to avoid unnecessarily obscuring the concept of the present disclosure.

[0023] Various structural schematic diagrams according to embodiments of the present disclosure are shown in the accompanying drawings. The figures are not drawn to scale, with certain details exaggerated and possibly omitted for clarity of presentation. The shapes of the various regions and layers shown in the figure, as well as their relative sizes and positional relationships are only exemplary, and may deviate due to manufacturing tolerances or technical limitations in practice, and those skilled in the art will Regions / layers with different shapes, s...

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PUM

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Abstract

The invention provides a grinding pad finishing unit. The unit comprises a finishing disc used for carrying out finishing on the surface property of a grinding pad, and at least one nozzle mounted onthe finishing disc and used for spraying cleaning media. According to the grinding pad finishing unit, the finishing disc is used for grinding grinding slag stacked on the surface of the grinding pad,meanwhile, the nozzle sprays the cleaning media, when the grinding slag is ground down, the grinding slag is immediately cleaned by the cleaning media sprayed by the nozzle, the good cleaning effectcan be provided, and the probability of scratch and defect appearing in a ground silicone wafer can be greatly reduced.

Description

technical field [0001] The invention relates to the technical field of chemical mechanical polishing, in particular to a polishing pad conditioning unit and device. Background technique [0002] There are holes or lines on the polishing pad for the inflow and discharge of the abrasive slurry, and during the polishing process, the generated abrasive residues tend to remain in the holes or lines. In the prior art, in order to remove the grinding slag remaining in the pores or lines, high-pressure pure water is used for cleaning. When the ability to clean the grinding slag on the polishing pad is insufficient, the grinding slag will accumulate in the pores or lines, and the accumulated grinding slag will easily cause scratches or defects on the surface of the polished silicon wafer during the subsequent grinding process. Contents of the invention [0003] The polishing pad conditioning unit and device provided by the invention can have a good cleaning effect on the polishing...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B53/017B24B53/02B24B53/14B08B3/02
CPCB08B3/02B24B53/017B24B53/02B24B53/14
Inventor 丁彦荣张月杨涛卢一泓刘青
Owner INST OF MICROELECTRONICS CHINESE ACAD OF SCI
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