Construction method of integrated circuit bumps

Abstract

The invention discloses a construction method of integrated circuit bumps. The construction method comprises an integrated circuit preparation step, a bump metal film mounting step, a bump metal filmpatterning step, a bump metal film non-functional region separation step and a welding step. The construction method of the integrated circuit bumps has the characteristics of small bump spacing, small-size processing capability, wide thickness application range, simple manufacturing process, high forming speed, high yield, low cost and the like, and can meet the trend of miniaturization of an integrated circuit.

Description

technical field [0001] The invention relates to a construction method of an integrated circuit bump. Background technique [0002] The trend of miniaturization of integrated circuits is reflected in: 1) The product pitch is getting smaller and smaller; 2) The size and height of bumps are miniaturized; 3) The number of bumps per unit area is increasing; 4) The cost of bumps per unit 5) The requirements for process yield are getting higher and higher. [0003] At present, there are mainly four types of integrated circuit bump forming technologies: [0004] (1) Sphere Ball Bumping: Please refer to figure 1 The ball planting process includes a substrate preparation step 11, a flux coating step 12, a stencil placement step 13, a solder ball placement step 14, and a reflow and cleaning step 15. [0005] The advantages of the ball planting process are: the bump size is uniform and the reliability is good; [0006] The disadvantages are: the minimum size of spherical bumps is li...

AI Technical Summary

Problems solved by technology

[0006] Disadvantages: the minimum size of spherical bumps is limited, and the minimum diameter of the spheres in the industry is 60-80um; and special tooling is required for ball planting

[0009] The disadvantages are: selective electroplating requires photoresist or other masks, and produces more liquid pollutants and solid pollutants; it takes a long time for unit thickness bumps, and the production efficiency is low when thicker bumps are required; for large For area bump forming, due to the uneven distribution of current density, the problem of poor consistency of bump height needs to be solved; alloy bumps cannot be plated, and the reliability is limited

[0012] The disadvantages are: because of the need for fixtures, the minimum size of the printed bumps is limited by the thickness of the stencil; the way the bumps are dotted is limited by materials and equipment, and the size and production efficiency are limited; the printing method has inconsistent bump sizes. question

[0014] The disadvantages are: it can only be applied on the wafer at present; the production efficiency is relatively low and the cost is high

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