A method of constructing an integrated circuit bump

Abstract

The invention discloses a method for constructing an integrated circuit bump, which comprises the step of preparing an integrated circuit, mounting a bump metal film, patterning a bump metal film, removing a non-functional area of ​​the bump metal film, and welding. The method for constructing integrated circuit bumps of the present invention has the characteristics of small bump spacing, small-size processing capability, wide range of thickness adaptation, simple manufacturing process, fast forming speed, high yield rate, and low cost, and can meet the requirements of miniaturization of integrated circuits. trend.

Description

technical field [0001] The present invention relates to a method for constructing an integrated circuit bump. Background technique [0002] The trend of miniaturization of integrated circuits is reflected in: 1) The product pitch is getting smaller and smaller; 2) The size and height of bumps are developing towards miniaturization; 3) The number of bumps per unit area is increasing; 4) The cost per bump Lower and lower; 5) The process yield requirements are getting higher and higher. [0003] At present, IC bump forming technology mainly includes the following four types: [0004] (1) Sphere Ball Bumping: Please refer to figure 1 , the ball placement process includes a substrate preparation step 11 , a flux coating step 12 , a stencil placement step 13 , a solder ball placement step 14 , and a reflow and cleaning step 15 . [0005] The advantages of the ball-mounting process are: uniform bump size and good reliability; [0006] The disadvantage is: the minimum size of th...

AI Technical Summary

Problems solved by technology

[0006] Disadvantages: the minimum size of spherical bumps is limited, and the minimum diameter of the spheres in the industry is 60-80um; and special tooling is required for ball planting

[0009] The disadvantages are: selective electroplating requires photoresist or other masks, and produces more liquid pollutants and solid pollutants; it takes a long time for unit thickness bumps, and the production efficiency is low when thicker bumps are required; for large For area bump forming, due to the uneven distribution of current density, the problem of poor consistency of bump height needs to be solved; alloy bumps cannot be plated, and the reliability is limited

[0012] The disadvantages are: because of the need for fixtures, the minimum size of the printed bumps is limited by the thickness of the stencil; the way the bumps are dotted is limited by materials and equipment, and the size and production efficiency are limited; the printing method has inconsistent bump sizes. question

[0014] The disadvantages are: it can only be applied on the wafer at present; the production efficiency is relatively low and the cost is high

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