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Three-dimensional integrated programmable optical filter

An optical filter and three-dimensional integration technology, applied in optics, nonlinear optics, instruments, etc., can solve problems such as bending loss, achieve the effects of improving transmission efficiency, saving chip area, and improving performance

Active Publication Date: 2020-09-01
SOUTHEAST UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, traditional integrated optoelectronic devices are mainly based on two-dimensional planar integration. Due to the particularity of optical transmission, small-radius curved waveguides will cause serious bending losses. Two-dimensional integration is already close to the system density limit. Therefore, the development of suitable three-dimensional integration device imperative

Method used

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Embodiment Construction

[0023] The technical solutions of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0024] The present invention designs a three-dimensional integrated programmable optical filter, such as figure 1 As shown, it includes a substrate layer 111 , an opaque layer 112 and a flip-chip bonding layer 113 . The flip-chip bonding layer 113 and the substrate layer 111 are independent chips, the first-stage filter 121 is fabricated on the substrate layer 111 , and the second-stage filter 122 is fabricated on the flip-chip bonding layer 113 . The first-stage filter 121 and the second-stage filter 122 are both single-stage tunable optical filters, and a first coupling region 131 and a second coupling region 132 are arranged on the light-proof layer 112, and the first-stage filter The filter 121 and the second-stage filter 122 are connected through a first coupling region 131 and a second coupling region 132 .

[0025] The basic struct...

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PUM

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Abstract

The invention discloses a three-dimensional integrated programmable optical filter. The filter comprises a substrate layer, a lightproof layer and a flip-chip bonding layer; the flip-chip bonding layer and the substrate layer are independent chips respectively; a first-stage filter is manufactured on the substrate layer; a second-stage filter is manufactured on the flip-chip bonding layer; the first-stage filter and the second-stage filter are both single-stage tunable optical filters; each single-stage tunable optical filter is formed by cascading a plurality of micro-rings; vertical couplingis adopted between every two adjacent stages of micro-rings, and a layer of lightproof material is arranged between every two adjacent stages of micro-rings. By utilizing a three-dimensional integration technology, the occupied area of the chips is greatly reduced; by utilizing a vertical coupling mode, the transmission efficiency of light is improved, and the transmission loss of the high-ordermicro-ring filter is effectively reduced; the two stages of filters are respectively manufactured on independent chips; a product with the best performance can be obtained through screening and testing; and the thermal crosstalk of the thermo-optic effect can be reduced to the minimum.

Description

technical field [0001] The invention belongs to the technical fields of optical communication and microwave photons, and in particular relates to a programmable optical filter. Background technique [0002] In optical signal processing, the use of optical filters is essential, but most common filters are not adjustable. If the filtering range needs to be changed due to parameter changes, usually only a new filter can be replaced. If the filter is programmable, then in this case filter parameters can be changed quickly to meet new scene requirements. Therefore, compared with the traditional fixed optical filter, the programmable optical filter has the characteristics of flexible and convenient use. [0003] Integration is the current development trend of optoelectronic devices. Integration can reduce the volume of optoelectronic devices and increase system density. However, traditional integrated optoelectronic devices are mainly based on two-dimensional planar integration....

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02F1/01
CPCG02F1/0147
Inventor 刘旭叶重荫曹林浩孙小菡
Owner SOUTHEAST UNIV
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