A 3D Integrated Programmable Optical Filter

An optical filter and three-dimensional integration technology, applied in optics, nonlinear optics, instruments, etc., can solve problems such as bending loss, achieve the effects of improving transmission efficiency, saving chip area, and miniaturization

Active Publication Date: 2022-04-29
SOUTHEAST UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, traditional integrated optoelectronic devices are mainly based on two-dimensional planar integration. Due to the particularity of optical transmission, small-radius curved waveguides will cause serious bending losses. Two-dimensional integration is already close to the system density limit. Therefore, the development of suitable three-dimensional integration device imperative

Method used

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  • A 3D Integrated Programmable Optical Filter
  • A 3D Integrated Programmable Optical Filter
  • A 3D Integrated Programmable Optical Filter

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Embodiment Construction

[0023] The technical solutions of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0024] The present invention designs a three-dimensional integrated programmable optical filter, such as figure 1 As shown, it includes a substrate layer 111 , an opaque layer 112 and a flip-chip bonding layer 113 . The flip-chip bonding layer 113 and the substrate layer 111 are independent chips, the first-stage filter 121 is fabricated on the substrate layer 111 , and the second-stage filter 122 is fabricated on the flip-chip bonding layer 113 . The first-stage filter 121 and the second-stage filter 122 are both single-stage tunable optical filters, and a first coupling region 131 and a second coupling region 132 are arranged on the light-proof layer 112, and the first-stage filter The filter 121 and the second-stage filter 122 are connected through a first coupling region 131 and a second coupling region 132 .

[0025] The basic struct...

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Abstract

The invention discloses a three-dimensional integrated programmable optical filter, which comprises a substrate layer, an opaque layer and a flip-chip bonding layer. The flip-chip bonding layer and the substrate layer are independent chips, and the first The first-stage filter, the second-stage filter is made on the flip-chip bonding layer, the first-stage filter and the second-stage filter are both single-stage tunable optical filters, and the single-stage tunable optical filter consists of multiple The microrings are cascaded, vertical coupling is adopted between two adjacent stages of microrings, and a layer of opaque material is arranged between adjacent two stages of microrings. The invention utilizes the three-dimensional integration technology to greatly reduce the occupied area of ​​the chip; utilizes the vertical coupling method to improve the transmission efficiency of light, and effectively reduces the transmission loss of the high-order micro-ring filter; the two-stage filters are respectively manufactured on independent chips , can pass the screening test to get the best performance products, and can minimize the thermal crosstalk of thermo-optic effect.

Description

technical field [0001] The invention belongs to the technical fields of optical communication and microwave photons, and in particular relates to a programmable optical filter. Background technique [0002] In optical signal processing, the use of optical filters is essential, but most common filters are not adjustable. If the filtering range needs to be changed due to parameter changes, usually only a new filter can be replaced. If the filter is programmable, then in this case filter parameters can be changed quickly to meet new scene requirements. Therefore, compared with the traditional fixed optical filter, the programmable optical filter has the characteristics of flexible and convenient use. [0003] Integration is the current development trend of optoelectronic devices. Integration can reduce the volume of optoelectronic devices and increase system density. However, traditional integrated optoelectronic devices are mainly based on two-dimensional planar integration....

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02F1/01
CPCG02F1/0147
Inventor 刘旭叶重荫曹林浩孙小菡
Owner SOUTHEAST UNIV
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