An integral high-efficiency cooling system for a high-power density cabinet

Abstract

The invention discloses an overall high-efficiency cooling system for a cabinet with high power density. The overall high-efficiency cooling system of the high-power-density cabinet includes a pump-driven two-phase loop high-power chip direct cooling system and a cabinet air-cooling system. The cabinet air cooling system includes a refrigerant circulation circuit and an air circulation circuit in the cabinet. In order to cope with different cycle conditions, the refrigerant cycle can be divided into two circuits, one is a pump-driven two-phase cycle, and the other is a vapor compression cycle. The pump-driven two-phase loop high-power chip direct heat dissipation system can conduct fixed-point heat dissipation for the main heat-generating components in the server, such as CPU and GPU, and the cabinet air-cooling system can perform air-cooling and heat dissipation for other heat-generating components in the server. The combination of fixed-point heat dissipation for high-power density chips and air-cooled heat dissipation for low-power-density components, on the one hand, direct fixed-point heat dissipation for high-power chips, and on the other hand, can get rid of the server cabinet's dependence on air conditioning cooling, and efficiently solve the overall heat dissipation of the server cabinet The problem.

Description

technical field [0001] The invention relates to an overall high-efficiency cooling system for a cabinet with high power density. Background technique [0002] With the rapid development of information technology, the demand for servers with faster computing speed and more powerful functions has soared, which has led to a significant increase in the power density of a single cabinet. The main heating elements on the motherboard are CPU, GPU, etc., whose heating power accounts for 60% to 70% of the total heating power, and other heating elements on the motherboard account for 30% to 40% of the total heating power. Through the pump-driven two-phase loop high-power chip heat dissipation system, the heat dissipation of the main heating elements on the motherboard has been well solved, but the heat dissipation of other heating elements on the motherboard still needs to be solved. [0003] At present, when evaluating the energy efficiency of data centers, the PUE (Power Usage Effe...

AI Technical Summary

Problems solved by technology

The traditional method is to use the air conditioner in the computer room to cool the other heating elements on the motherboard, but usually the computer room occupies a large area, and the distance between the air conditioner and the heating elements is far away, so it is difficult for the air conditioner to accurately remove the heat generated by other heating elements on the motherboard.

At the same time, in the air circulation loop of the air conditioner in the computer room, the hot and cold air are mixed with each other, the temperature difference between the air and the heating element is reduced, and the heat transfer effect is seriously reduced.

In this case, whether it is to increase the air volume or reduce the temperature of the cooling air itself to increase the temperature difference, it will significantly increase the energy consumption of the cooling equipment in the computer room, resulting in a larger PUE value and greatly increasing the operating cost of the computer room.

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