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A kind of LED vacuum encapsulation process and vacuum pressing device

A vacuum packaging and vacuum pressing technology, which is applied to semiconductor devices, electrical components, circuits, etc., can solve the problems of uneven distribution of fluorescent films, affecting luminous effects, and low production efficiency, so as to achieve good appearance consistency, improve production efficiency, The effect of stimulating light color uniformity

Active Publication Date: 2021-11-30
HONGLI ZHIHUI GRP CO LTD
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Problems solved by technology

[0002] In the traditional LED packaging technology, the process of die-bonding-coating-dispensing is adopted, which has many procedures and relatively low production efficiency, and there may be uneven distribution of fluorescent film on the surface of the wafer, which affects the luminous effect. Therefore, it is necessary to Improve

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  • A kind of LED vacuum encapsulation process and vacuum pressing device
  • A kind of LED vacuum encapsulation process and vacuum pressing device
  • A kind of LED vacuum encapsulation process and vacuum pressing device

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Embodiment Construction

[0025] The present invention will be described below in conjunction with the accompanying drawings and specific embodiments.

[0026] Such as figure 1 , 2 , 3, and 5, a vacuum packaging process for LEDs, comprising the following steps:

[0027] (1) Die bonding on the substrate 1, and the chip 2 is flipped on the substrate 1;

[0028] (2) Press the edge of the fluorescent soft film 3 on the substrate 1 in a vacuum environment, and the inner part of the fluorescent soft film 3 located at the pressed edge is not pressed, and the chip mounting area 4 is formed between the substrate 1 and the fluorescent soft film 3 ;

[0029] (3) Unload the vacuum;

[0030] (4) Baking and curing the fluorescent soft film 3;

[0031] (5) Segmentation and cutting of the substrate 1 to form a single packaged LED 5 .

[0032] Such as Figure 4 As shown, the structure of the vacuum pressing device used in the above step (2) is as follows: the vacuum pressing device includes a vacuum chamber 6, an...

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Abstract

A LED vacuum packaging process, comprising the following steps: (1) solidifying the crystal on the substrate; (2) pressing the edge of the fluorescent soft film on the substrate in a vacuum environment, and the inner part of the fluorescent soft film located at the pressed edge is not Pressing, the chip mounting area is formed between the substrate and the fluorescent soft film; (3) Vacuum release. Using the above technical solution, the substrate after solid crystal is placed in a vacuum pressing device for vacuum pressing of the fluorescent soft film. The fluorescent soft film is only pressed on the outer periphery of the substrate, and the wafer mounting area in the middle forms a vacuum cavity, so the substrate is removed. After the vacuum chamber, under the action of external pressure, the fluorescent soft film is tightly pressed on the chip and the substrate. The fluorescent film evenly covers the surface of the chip, and the appearance is consistent, which can make the excitation light color more uniform and save the original Some coating and dispensing processes greatly improve production efficiency. In addition, the invention also provides a corresponding vacuum pressing device.

Description

technical field [0001] The invention relates to the technical field of LED packaging, in particular to an LED vacuum packaging process and a vacuum pressing device. Background technique [0002] In the traditional LED packaging technology, the process of die-bonding-coating-dispensing is adopted, which has many procedures and relatively low production efficiency, and there may be uneven distribution of fluorescent film on the surface of the wafer, which affects the luminous effect. Therefore, it is necessary to Improve. Contents of the invention [0003] The object of the invention is to provide a LED vacuum packaging process with high production efficiency and uniform distribution of fluorescent films. To achieve the above object, the present invention adopts the following technical solutions: [0004] A LED vacuum packaging process, comprising the following steps: [0005] (1) Die bonding on the substrate; [0006] (2) Press the edge of the fluorescent soft film on t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/48H01L33/50H01L25/075
CPCH01L25/0753H01L33/48H01L33/505H01L2933/0033H01L2933/0041
Inventor 赵明深
Owner HONGLI ZHIHUI GRP CO LTD
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