Detection device and detection method

Abstract

The invention provides a detection device and a detection method, and the device comprises a first detection light source which is used for transmitting first detection light to a first detection region of a to-be-detected object; a detection device used for receiving the first detection light returned by the first detection region; an out-of-focus measurement system used for measuring the out-of-focus degree of the to-be-measured object relative to a detection system and comprising a second detection light source used for emitting second detection light to a second detection region of the to-be-measured object; a receiving assembly used for receiving the second detection light returned by the second detection region and obtaining the defocusing power of the second detection region according to the returned second detection light, wherein the second detection region at least partially coincides with the first detection region; and an adjusting device used for adjusting the relative position relation between the to-be-detected object and the detection system according to the defocusing power. According to the detection system, the precision of a detection result can be improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor equipment, in particular to a detection device and a detection method. Background technique [0002] Optical inspection is a general term for detection methods that utilize the interaction between light and chips, among which light scattering method is one of the most important optical inspection methods. Presence and size. Optical detection has the characteristics of fast detection speed and no additional pollution, and is the best solution for on-line detection of chips. [0003] The detection accuracy of optical detection equipment is affected by the defocus of the optical path. The light source, illumination shaping mirror group, wafer surface, signal collection mirror group, and detector in the second detection optical path can collect the strongest scattered signal light when they meet a certain positional relationship. , the situation that satisfies this positional relationship can ...

AI Technical Summary

Problems solved by technology

In addition, when the electric moving platform drives the wafer to move, it may also introduce a height offset, resulting in an out-of-focus state

Even if the wafer height has been adjusted to focus at the beginning of the scanning inspection, there is still defocus at other inspection positions, which limits the accuracy of the wafer defect inspection equipment

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