Aluminum substrate foil plate pressing device based on light path positioning

Abstract

The invention provides an aluminum substrate foil plate pressing device based on light path positioning, which belongs to the technical field of aluminum substrate foil plate pressing devices and comprises a mounting component, a pushing mechanism and a pressing mechanism, wherein the pushing mechanism comprises a first mounting plate, a first driving piece and a pushing block, the first mountingplate is fixed to the mounting base, the first driving piece is fixed to the first mounting plate, and the pushing block is fixed to the first driving piece; the pressing mechanism comprises a mounting frame, two connecting blocks, a second driving part, a first fixing plate, a pressing block and a CCD camera; the mounting frame is fixedly connected with the two connecting blocks, the two connecting blocks are fixedly installed on the two sides of the mounting base respectively, the second driving piece is fixed to the mounting frame, the first fixing plate is fixed to the second driving piece, the pressing block is fixed to the first fixing plate, and the CCD camera is fixedly mounted on the mounting frame. The whole device is simple in structure, easy to operate, capable of achieving automatic feeding, pressing and discharging, free of manual operation, high in working efficiency and good in safety.

Description

technical field [0001] The present invention relates to the technical field of an aluminum substrate foil lamination device, in particular to an aluminum substrate foil lamination device based on optical path positioning. Background technique [0002] With the development of light, thin, small, high-density, and multi-functional electronic products, the assembly density and integration of components on the PCB are getting higher and higher, and the power consumption is increasing. The heat dissipation requirements of the PCB substrate are becoming more and more urgent. If the heat dissipation of the substrate is not good, it will cause the components on the printed circuit board to overheat, thereby reducing the reliability of the whole machine. In this context, high heat dissipation metal PCB substrates were born. Aluminum substrates are the most widely used metal substrates, and have good thermal conductivity and electrical insulation. [0003] The aluminum substrate is g...

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Problems solved by technology

[0004] In order to make up for the above deficiencies, the present invention provides an aluminum substrate foil plate lamination device based on optical path positioning, which aims to improve the lamination work of aluminum substrates. Pressing. After the pressing is completed, the product is manually taken out of the pressing machine. The work efficiency is low. The worker needs to go deep into the pressing machine to take out the material, which is not safe. At present, there are pressing devices that automatically take out the material on the market. However, the structure is complicated, the operation is troublesome, and the input cost is high.

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