Flexible heat pipe and machining method thereof

Abstract

The invention discloses a flexible heat pipe and a machining method thereof. The flexible heat pipe comprises a flexible main body, a first metal sheet and a second metal sheet, wherein the flexible main body can be bent, the flexible main body is made of a flexible material, the flexible main body is internally provided with an evaporation cavity, a condensation cavity, and a liquid channel and agas channel for connecting the evaporation cavity and the condensation cavity, and the evaporation cavity and the condensation cavity are both of a cavity structure with the bottom surface or the side surface open. According to the flexible heat pipe, working liquid is injected into the flexible main body, and the working liquid is arranged between the evaporation cavity and the condensation cavity, and flows through the gas channel and the liquid channel to achieve heat transfer. Due to the fact that the flexible main body is made of the flexible material and capable of being bent along withan electronic device, the heat dissipation requirement of the electronic device which is narrow in space and foldable under complex working conditions can be met, effective heat transfer is achievedby arranging the first metal sheet and the second metal sheet, the adverse effect of poor heat conduction performance of a flexible material is avoided, and the flexible heat pipe is applied to the technical field of heat pipes.

Description

technical field [0001] The invention relates to the technical field of heat pipes, in particular to a flexible heat pipe and a processing method thereof. Background technique [0002] With the development of science and technology, the performance of various high-power electronic products continues to improve, and the volume continues to develop towards miniaturization, which leads to the continuous increase of the heat generation of electronic devices, while the volume is getting smaller and smaller, resulting in more and more concentrated energy consumption. , heat dissipation technology is also constantly updated. At present, a heat sink composed of multiple traditional heat pipes and a fan can only barely solve the heat dissipation problem of current electronic products. A high-quality and high-efficiency thermal control system is very important to ensure that electronic products can operate stably under the development trend of miniaturization and high integration. Ex...

AI Technical Summary

Problems solved by technology

Existing heat pipe radiators cannot fully meet the heat dissipation requirements of high power under high integration, such as the heat dissipation requirements of micro electronic components with small space and foldable electronic devices (such as folding screens) and other complex working conditions

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