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Heat sink

A heat sink and heat sink technology, applied in heat sinks, indirect heat exchangers, heat transfer modification, etc., can solve the problems of high pressure loss, high thermal conductivity, small space for heat carrier flow, etc., to reduce pressure Loss, increase thermal conductivity, promote the effect of amplification effect

Pending Publication Date: 2020-09-15
MITSUBISHI MATERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] However, in the heat sink described in Patent Document 1, since the heat sink is made of a solid material, the surface area is small, and high thermal conductivity cannot be expected.
In the heat sink described in Patent Document 2, the specific surface area of ​​the porous body is high, so the thermal conductivity is high, but the space for the heat medium to flow is small, so the pressure loss is too high
In the structure described in Patent Document 3, the coil is a wire material with a small cross-sectional area and high thermal resistance, so it is difficult for heat to diffuse throughout the coil

Method used

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Embodiment

[0069] As an embodiment of the present invention (sample numbers 1 to 3), a image 3 The heat sink 101 with the plate-shaped (plate-shaped) fin part 12 of the above-mentioned embodiment is shown. The board|substrate part 11 was made into vertical dimension: S1=55mm, lateral dimension: S2=38mm, plate thickness: h0=4mm, and the heat sink part 12 was formed over the whole length of the board|substrate part 11.

[0070] The height h1 of each fin portion 12 was set to 6 mm. The number of fin portions 12, the separation distance c1 of the fin portions 12 (the width of the groove portion 13) c1, and the side edge surface ( The separation distance c2 of the end groove portion 13A), the maximum outer diameter DA and the minimum outer diameter DB of the coil-shaped metal wire 21, the total length (full length of a single coil) L of a single coil-shaped metal wire 21, and the number of windings N are set as follows: Table 1.

[0071] The minimum outer diameter DB of each coil-shaped m...

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Abstract

A heat sink comprises a metallic molding having a base plate part and two or more fin parts standing on the surface of the base plate part and disposed parallel to one another, and a filler composed of a plurality of coiled metal wires filled in one or more groove parts formed between the fin parts of the metal molding. The external diameter of the coiled metal wires is such that a first externaldiameter toward one end portion and a second external diameter toward the other end portion are different. Each of the coiled metal wires has a part that is metallurgically joined to at least anothercoiled metal wire or the inner surface of the groove part of the metal molding.

Description

technical field [0001] The invention relates to a radiator for dissipating heat. [0002] This application claims priority based on Japanese Patent Application No. 2018-028359 filed on February 21, 2018, and uses the content thereof here. Background technique [0003] In an electronic component that generates heat, such as a power module on which a semiconductor element such as a power element is mounted, a heat sink is provided for dissipating heat from the heat-generating semiconductor element in order for the electronic component to operate normally. This heat sink is made of aluminum or copper with high thermal conductivity, and generally utilizes a structure in which a plurality of plate-shaped or needle-shaped fins are vertically provided on one surface of a plate-shaped substrate. In such a heat sink, the substrate portion is brought into close contact with a cooling target such as a power module, and a cooling fin is arranged in a heating medium flow path to cool th...

Claims

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Application Information

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IPC IPC(8): H01L23/36H05K7/20
CPCH01L23/367H01L23/3736F28F2215/10F28D2021/0029H01L23/3672H01L23/3677F28F3/02F28F13/12
Inventor 渡边光太郎幸俊彦
Owner MITSUBISHI MATERIALS CORP