Heterojunction three-dimensional magnetic field measurement Hall sensor based on planar process
A Hall sensor and three-dimensional magnetic field technology, applied in the field of magnetic measurement, can solve problems such as high process requirements, difficult preparation, and chip integration, and achieve high-sensitivity effects
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[0025] Such as image 3 As shown, the structure schematic diagram of the heterojunction three-dimensional magnetic field measurement Hall sensor based on the planar process provided by the embodiment; the Hall sensor includes a substrate 10, and a center of a cube structure formed on the substrate and located in the center Electrode c1, four identical cross-shaped magnetic induction areas formed on the substrate and in close contact with the four sides of the central electrode, are respectively the first cross-shaped magnetic induction area s1, the second cross-shaped magnetic induction area s2, the thirtieth cross-shaped magnetic induction area Zigzag-shaped magnetic induction area s3, fourth cross-shaped magnetic induction area s4, the cross-shaped magnetic induction area includes a channel layer 20, an isolation layer 30, a cap layer 50 and a passivation layer 60 arranged sequentially on the substrate from bottom to top, The delta-doped layer 40 is located in the isolation ...
Embodiment 3
[0031] The three-dimensional Hall sensor of the embodiment adopts GaAs substrate, and the heterojunction is used as the magnetic induction region to realize the magnetic field sensing in the three directions of X, Y, and Z. At the same time, the sensitivity of the magnetic field induction is also in a relatively high range (the voltage-dependent sensitivity of the magnetic field in the Z direction About 360mV / VT, the voltage sensitivity of the magnetic field in the X and Y directions is about 188mV / VT), such as Figure 6 shown. The three-dimensional Hall sensor obtained in the present invention has a small volume and a simple preparation process. The sensor can be prepared by using a simple planar process, is easy to integrate with chips, and can be widely used in various equipment systems.
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