A system and method for generating an assembly process flow of a multi-chip component
A multi-chip component and process flow technology, applied in the field of multi-chip component assembly process flow generation system, can solve the problems of low efficiency and accuracy, multi-chip component assembly process compilation relies on manual work, etc., to reduce requirements and improve production The effect of efficiency and accuracy
Active Publication Date: 2022-03-18
SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP
View PDF8 Cites 1 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0003] Aiming at the above-mentioned deficiencies in the prior art, the present invention provides a multi-chip module assembly process flow generation system and method, which solves the problems of relying on manual labor, low efficiency and low accuracy for the preparation of multi-chip component assembly process flow
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0053] Specific embodiments of the present invention are described below so that those skilled in the art can understand the present invention, but it should be clear that the present invention is not limited to the scope of specific embodiments. For those of ordinary skill in the art, as long as various changes Within the spirit and scope of the present invention defined and determined by the appended claims, these changes are obvious, and all inventions and creations using the concept of the present invention are included in the protection list.
[0054] like figure 1 As shown, an assembly process flow generation system for multi-chip components, including:
[0055] The design information extraction module is used to extract design information related to the assembly process flow from the input design file;
[0056] The process information assignment module is used to assign values to the process information that is not included in the design file but is necessary for the...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention discloses a system and method for generating an assembly process flow of a multi-chip component, including a design information extraction module, a process information assignment module, a process global mapping module, a process determination module, a process sequencing module, a manual confirmation module, and a process step mapping module and assembly process flow generation module. The invention is generated through the computer-aided multi-chip component assembly process flow, which can significantly improve the generation efficiency and accuracy of the process flow, and reduce the requirements for the experience of process personnel in the preparation of the process flow.
Description
technical field [0001] The invention belongs to the field of integrated circuit packaging, and in particular relates to a system and method for generating an assembly process flow of a multi-chip component. Background technique [0002] Multi-chip module (MCM, Multi-Chip Module) is to assemble bare chips, discrete components and other components on high-density interconnect substrates and interconnect and package them to realize high-density microelectronic components with certain functions. Typical assembly elements Including bare chips, discrete components, substrates, bonding wires, package shells, etc. Typical assembly processes include reflow soldering, die bonding, chip eutectic, chip flip chip, wire bonding, etc. With the increasing integration of multi-chip components, the difficulty of compiling the assembly process of multi-chip components is also increasing. The process compilation methods relying on manual means and process experience have problems of low efficie...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Patents(China)
IPC IPC(8): G06Q10/06G06Q50/04
CPCG06Q10/06316G06Q50/04Y02P90/30
Inventor 伍艺龙曾策李杨张晏铭潘玉华庞婷侯奇峰李阳阳毛小红徐榕青向伟玮
Owner SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP