Chemical polishing machine for metal processing

Abstract

The invention relates to the technical field of metal processing, and discloses a chemical polishing machine for metal processing, which includes a base, a housing is fixedly installed on the outside of the top of the base, a titration device is fixedly installed on the top of the housing, and a titration device is fixed on the top of the base. A support column is fixedly installed at the center, and the guide wheel contacts the bottom of the main rotating plate, causing the main rotating plate to incline, and is movably socketed on the outside of the limiting tube through the limiting hole through the main rotating plate. The inclination angle of the main rotating plate is limited and will not fall off, and at the same time, the chemical droplets dripping on the surface of the metal material can be separated by gravity toward the center of the auxiliary rotating plate, thereby reducing the rotation of the auxiliary rotating plate. The centrifugal effect generated by the coming centrifugal force makes the chemical agent not move outward due to the increase of centrifugal force when it is on the outside of the metal material, which improves the contact time of the chemical agent on the outer contact point of the metal material.

Description

technical field [0001] The invention relates to the technical field of metal processing, in particular to a chemical polishing machine for metal processing. Background technique [0002] The chemical polishing machine regularly dissolves the surface of the material through a unique chemical agent to achieve a bright and smooth machine equipment. Since the surface of the material shows a rough shape in the micro, the chemical agent will preferentially dissolve the raised position, and the dissolution rate The dissolution rate is greater than that of the concave part, and finally makes the surface of the material smooth. The existing equipment will use the spin titration method when chemically polishing the thin metal material. The titration device will directly drop the chemical agent on the surface of the metal material. The metal material is rotated by rotation, and the chemical agent will slide on the metal surface under the influence of the rotation, and continuously move...

AI Technical Summary

Problems solved by technology

[0004] Aiming at the deficiencies in the use of the existing chemical polishing machine proposed in the background technology, the present invention provides a chemical polishing machine for metal processing, which can control the contact time of each contact point when the chemical agent is dropped on the surface of the metal material. Balance to achieve the advantages of similar polishing rates on the inner and outer sides, and solve the problem that the polishing speed of the inner and outer sides is inconsistent when the existing equipment is polished, which leads to an increase in the probability of defective product output

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