A cooling device for computers based on the Internet of Things

Abstract

A cooling device for a computer based on the Internet of Things, including a chassis, a motherboard is installed in the chassis, a processor is installed on the motherboard, a heat dissipation copper plate is arranged on the upper part of the processor, an S-shaped channel is opened in the heat dissipation copper plate, and the inlet and outlet of the S-shaped channel are respectively located at the heat dissipation At the left and right ends of the copper plate, there is a water tank on the top side of the chassis. The inlet and outlet of the S-shaped channel are connected to the water tank through the first C-shaped tube and the second C-shaped tube respectively. The top of the cooling copper plate is equipped with a box with the opening facing down. A first through hole is opened in the middle of the top surface of the box body, a vertical shaft is installed in the first through hole through a sealed bearing, and several fan blades are installed on the outer periphery of the lower end of the vertical shaft, two sides are symmetrically opened on both sides of the first through hole on the top surface of the box body. a second through hole. This device realizes the ingenious combination of various heat dissipation methods such as water cooling, air cooling, and evaporation heat absorption, which greatly improves the heat dissipation effect of the computer. It has heat dissipation capabilities that traditional heat dissipation methods do not have. It can also improve the computer environment.

Description

technical field [0001] The invention belongs to the technical field of computer cooling, in particular to a cooling device for a computer based on the Internet of Things. Background technique [0002] The CPU (that is, the processor) and other components of a computer will generate heat during high-speed operation, and if the heat is allowed to accumulate, it is likely that the CPU and other components will eventually be burned out. Therefore, when designing a computer, it is necessary to Adding a heat dissipation system or heat dissipation structure, heat dissipation is actually a process of heat transfer, the purpose is to bring the heat generated by computer heating components, especially the CPU, to other media, and control the CPU temperature within a stable range. Most of the existing heat dissipation It is air-cooled and water-cooled. With the rapid development of computer processors, a good heat dissipation system can help it maximize its processing capacity. The exi...

AI Technical Summary

Problems solved by technology

[0002] The CPU (that is, the processor) and other components of a computer will generate heat during high-speed operation, and if the heat is allowed to accumulate, it is likely that the CPU and other components will eventually be burned out. Therefore, when designing a computer, it is necessary Adding a heat dissipation system or heat dissipation structure, heat dissipation is actually a process of heat transfer, the purpose is to bring the heat generated by computer heating components, especially the CPU, to other media, and control the CPU temperature within a stable range. Most of the existing heat dissipation It is air-cooled and water-cooled. With the rapid development of computer processors, a good heat dissipation system can help it maximize its processing capacity. The existing heat dissipation technology has limited heat dissipation effect. Now it is necessary to design a heat dissipation device with better effect

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