A heat-conducting silicone pad

Abstract

The invention relates to the field of silicone pads, in particular to a thermally conductive silicone pad, comprising a silicone pad body, a first heat dissipation mechanism and a second heat dissipation mechanism. The upper surface of the silicone cushion body is provided with a plurality of longitudinally arranged and equidistantly distributed The first heat dissipation mechanism is arranged in the cut groove, and the first heat dissipation mechanism includes an attachment groove, a copper sheet and an arc-shaped bucket groove. On the body of the silicone pad on the side, and each attachment groove is fixedly fitted with a longitudinally arranged copper sheet, the bottom of the cut groove is provided with an arc-shaped bucket slot, and the second heat dissipation mechanism is installed in the arc-shaped bucket slot. In the lower silicone pad body, the second heat dissipation mechanism includes a circular cavity, a copper rod and an adhesive, and the circular cavity is opened on the silicone pad body below the arc-shaped bucket groove and communicates with the arc-shaped bucket groove. . The thermally conductive silicone pad provided by the present invention has the advantages of being easy to curl and not easily cracked.

Description

technical field [0001] The invention relates to the field of silica gel pads, in particular to a heat-conducting silica gel pad. Background technique [0002] In daily life, people will widely use various electronic products, and all electronic products involve heat dissipation, because the temperature of electronic components in electronic products will increase during use, especially transistors and some semiconductors Components are particularly prone to heat. When the operating temperature of electronic components is high, the performance of electronic components will be reduced, so it is necessary to dissipate heat from electronic components. [0003] When the heat dissipation element is connected to the heat dissipation element, it is usually necessary to fill the gap between the heat dissipation element and the heat dissipation element with filling materials and thermal conductive materials, and some existing thermal conductive silicone pads are suitable for cylindric...

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Problems solved by technology

[0002] In daily life, people will widely use various electronic products, and all electronic products involve heat dissipation, because the temperature of electronic components in electronic products will increase during use, especially transistors and some semiconductors Components are particularly prone to heat. When the operating temperature of electronic components is high, the performance of electronic components will decrease, so it is necessary to dissipate heat from electronic components

[0003] When the heat dissipation element is connected to the heat dissipation element, it is usually necessary to fill the gap between the heat dissipation element and the heat dissipation element with filling materials and thermal conductive materials, and some existing thermal conductive silicone pads are suitable for cylindrical or large arc electronic components. , due to the large degree of curling, the thermally conductive silicone pad is easy to crack, and at the same time, the internal heat is difficult to conduct due to the curling of the thermally conductive silicone pad

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