LED display module and manufacturing method thereof, LED display screen and manufacturing method thereof

Abstract

The invention discloses an LED display module and a manufacturing method thereof, and an LED display screen and a manufacturing method thereof. The LED display module comprises a PCB, a plurality of groups of LED chips which are positioned on the first surface of the PCB and are electrically connected with the PCB, wherein each group of LED chips form a pixel point; an isolated gate which is positioned on the first surface of the PCB, wherein each pixel point is separated by the isolated gate; a packaging layer which is located on the first surface of the PCB and covers each LED; and a panel which is located on the surface of the packaging layer. According to the LED display module, all the pixel points are separated through the isolation gate structure, and therefore the problem of crosstalk between the adjacent pixel points is solved; the surface of the packaging layer is subjected to planarization processing, and the panel is arranged on the surface of the LED module, so that the surface appearance consistency of the LED module is improved, and the display effect is improved.

Description

technical field [0001] The invention relates to the field of semiconductor packaging, and more specifically, to an LED display module and a manufacturing method, an LED display screen and a manufacturing method. Background technique [0002] In recent years, LED (Light-Emitting Diode) display is developing towards high resolution, which makes more and more pixels per unit area. However, the traditional SMD (Surface Mounted Devices) LED devices are assembled with LED displays by SMD, so they cannot meet the current high-resolution display requirements. Specifically, when the device is smaller, the packaging difficulty of a single chip device increases, and the corresponding cost increases; and as the number of patches increases geometrically, the assembly efficiency decreases; when the spacing between LEDs is smaller, especially when the dot pitch When the size is below 800um, the difficulty of the placement process becomes more and more difficult, and the cost of the placem...

AI Technical Summary

Problems solved by technology

[0004] There are still many problems in the development of existing COB LED products, which make it impossible to promote and use them on a large scale

Specifically, due to the existence of seams and mosaics, the surface consistency of COB LED products is not good

Since the COB LED display module has a much larger product size than a single lamp bead or an all-in-one lamp bead, the pure injection molding method cannot guarantee the complete surface of the lamp board after injection molding due to the change of the surface shape of the mold and the fluctuation of the glue formula. The colors of the screens are consistent. After assembling into a display screen, the inconsistency of the surface color will be enlarged, and a phenomenon similar to "mosaic" will appear, which will affect the display effect.

Moreover, due to the thickness fluctuation of ±10% in the thickness of the PCB board, plus the tolerance of different injection molds, after injection molding, the thickness tolerance of the lamp board will be accumulated and enlarged, so that the unevenness of the lamp board will be prominent, and there will be seams. Affect the display effect

[0005] In addition, when the pixel pitch is less than 800um (micro-pitch), the front-mount chip cannot meet the requirements, and flip-chip is required

At the same time, due to the close distance between the chips of adjacent pixels, the light emitted by the LEDs will affect each other during display, and the cross-light phenomenon is obvious, resulting in poor screen clarity and a great impact on the display effect.

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