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Thin film packaging material and manufacturing method thereof, thin film packaging structure, and electronic device

A thin-film packaging and manufacturing method technology, applied in the direction of electric solid-state devices, electrical components, semiconductor devices, etc., can solve the problems of poor thermal stability and easy damage, so as to increase tolerance, improve effect, improve thermal stability and The effect of light transmittance

Pending Publication Date: 2020-10-16
EVERDISPLAY OPTRONICS (SHANGHAI) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] In view of this, the present application provides a thin film packaging material to solve the problems of poor thermal stability and easy damage of existing thin film packaging materials

Method used

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  • Thin film packaging material and manufacturing method thereof, thin film packaging structure, and electronic device
  • Thin film packaging material and manufacturing method thereof, thin film packaging structure, and electronic device
  • Thin film packaging material and manufacturing method thereof, thin film packaging structure, and electronic device

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Embodiment Construction

[0049] Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this application will be thorough and complete, and will fully convey the concept of the example embodiments to those skilled in the art. The same reference numerals denote the same or similar structures in the drawings, and thus their repeated descriptions will be omitted.

[0050] The invention provides a new thin film packaging material, which includes: a photoinitiator and a compound synthesized by a cage polysilsesquioxane group and an acrylate functional group; the structural formula of the compound is: D1— L1—POSS or D1—L1—(POSS)n—L2—D2; among them, POSS is a cage polysilsesquioxane group, D1 and D2 are acrylate functional groups, and L1 and L2 are alkylene or alkylene Ether group, n i...

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Abstract

The invention provides a thin film packaging material and a manufacturing method thereof, a thin film packaging structure and an electronic device. By introducing polyhedral oligomeric silsesquioxaneand a derivative unit thereof into a main chain or a side group of an acrylate monomer, the thermal stability and the light transmittance of an organic layer are improved by utilizing the structural characteristics of POSS while the tolerance of the organic layer to plasmas is improved, so that the thin film packaging effect is improved.

Description

technical field [0001] The present application relates to the field of display technology, in particular to a thin-film packaging material and a manufacturing method thereof, a thin-film packaging structure and electronic devices. Background technique [0002] Organic electroluminescent devices (OLEDs) are known as the most promising display devices due to their characteristics of self-luminescence, high brightness, high contrast, low operating voltage, and flexible display. In recent years, with the development of curved screens and foldable display devices, various bendable flexible OLED display devices have been developed. [0003] A flexible OLED display device generally includes a substrate, an electroluminescent element on the substrate, and a thin film encapsulation structure on the electroluminescent element. For flexible OLED devices, the encapsulation effect of the thin-film encapsulation structure directly affects its reliability and service life. Therefore, how ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/52H01L51/54
CPCH10K50/844H10K2102/00
Inventor 俞云海
Owner EVERDISPLAY OPTRONICS (SHANGHAI) CO LTD