Liquid cooling device and electronic equipment

Abstract

The invention discloses a liquid cooling device and electronic equipment employing the same. The device comprises a device main body which is provided with a counter bore at the end part, an end coverprovided with a boss matched with the counter bore; a sealing ring positioned between the bottom surface and the boss; and a rivet used for riveting the end cover at the end part of the device main body and pressing the sealing ring between the boss and a bottom surface, wherein a cooling liquid circulating cavity in the device main body forms an opening in the bottom surface of the counter bore.According to the liquid cooling device, an existing welding scheme is replaced by a scheme of combining riveting and interference fit modes of the sealing ring and the rivet, the sealing yield of theliquid cooling device is improved, corresponding materials do not need to be specified according to welding requirements, a large amount of welding cost is saved, and the overall manufacturing cost of the liquid cooling device and electronic equipment is reduced.

Description

technical field [0001] The invention relates to the technical field of liquid cooling and heat dissipation, in particular to a liquid cooling device and electronic equipment using the liquid cooling device. Background technique [0002] Electronic equipment, such as computers, will generate a lot of heat during operation. Therefore, in order to control the temperature of electronic equipment components so that the electronic equipment can be used normally, heat dissipation devices have long become an essential part of electronic equipment. [0003] The early heat sinks were mainly heat sinks, and the heat sinks were in thermal contact with the integrated circuit modules to assist in heat dissipation. With the development of integrated circuits, their power consumption became higher and higher, and subsequently, the heat sinks also developed to have multiple heat sinks. The structure of fins, and the use of fans for auxiliary heat dissipation has also been added. [0004] In...

AI Technical Summary

Problems solved by technology

[0007] At present, the various components of the liquid cold plate and the liquid collector are sealed by welding to realize the airtightness of the internal cavity. This welding method not only has a low yield rate, but also has strict requirements on the material type of the device. In addition, , the welding cost accounts for a large proportion of the cost of the entire liquid cooling plate and liquid collector device, for example, in some cases, the cost of the welding part in the cost of a single water cooling plate is close to 50% or even higher of the overall cost of the water cooling plate

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