Manufacturing device for processing high-thermal-conductivity material of multilayer aluminum-based cored printed circuit board

Abstract

The invention discloses a manufacturing device for processing a high-thermal-conductivity material of a multilayer aluminum-based cored printed circuit board. The device comprises a base, wherein a transverse plate is fixedly connected to the upper end of the base through a fixing rod, two driving rollers are rotatably connected to the upper end of the base through a vertical plate, a conveying belt is connected to the two driving rollers, and a driving motor for driving one driving roller to rotate is fixedly connected to the side wall of the vertical plate. According to the invention, a first roller rotates to drive a second roller to rotate, so a connecting belt drives a supporting plate to rotate, circuit boards on the supporting plate can be fed, and the situation that the circuit boards need to be manually placed on a detection line one by one and causes reduction in manufacturing efficiency of the circuit boards is avoided; and by rotating a double-end threaded rod, two slidingblocks drive a protection plate to slide through a U-shaped frame, so the circuit boards on a conveying belt are protected and corrected, the circuit boards can be kept in a unified state to be manufactured, and manufacturing efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of circuit board processing, in particular to a preparation device for processing high thermal conductivity materials of multilayer aluminum-based core printed circuit boards. Background technique [0002] Multi-layer circuit board refers to the conductive pattern layer with more than three layers and the insulating material between them are laminated at intervals. In order to ensure the service life of the circuit board, it is necessary to add heat-conducting materials when making the multi-layer circuit board. for high heat dissipation. [0003] At present, when configuring multi-layer circuit boards, the staff put the circuit boards one by one on the detection line, resulting in a decrease in the efficiency of circuit board preparation, because placing the circuit boards on the detection line will There is a phenomenon that the circuit board is placed obliquely, so that when the circuit board is slid on ...

AI Technical Summary

Problems solved by technology

[0003] At present, when configuring multi-layer circuit boards, the staff put the circuit boards one by one on the detection line, resulting in a decrease in the efficiency of circuit board preparation, because placing the circuit boards on the detection line will There is a phenomenon that the circuit board is placed at an angle, so that when the circuit board slides on the detection line for detection, the detection of the circuit board is inaccurate, which in turn affects the efficiency of circuit board preparation

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