Storage device, thermal insulation material for storage device and bundling and sealing method of thermal insulation material

A thermal insulation material and storage technology, applied in chemical instruments and methods, layered products, synthetic resin layered products, etc., can solve the problems of thermal insulation material dust leakage data storage, fragility, affecting the protection performance of data storage, etc.

Pending Publication Date: 2020-10-23
JIANGSU DU WAN ELECTRONICS TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, in the assembly process and practical application of the data storage, the thermal insulation material is easy to break and generate dust due to its own material characteristics. The cracking of the thermal insulation material will affect the protection performance of the data storage, and it will be subject to long-term damage in practical application. Influenced by external factors such as vibration, the heat insulation material dust leaks to the inside and surface of the data storage, which affects the work of the core module of the data storage and affects the appearance of the data storage.
[0005] To sum up, how to overcome the problem that the thermal insulation material in the memory is easy to break and leak powder in the prior art is a technical problem that needs to be solved urgently in the prior art.

Method used

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  • Storage device, thermal insulation material for storage device and bundling and sealing method of thermal insulation material
  • Storage device, thermal insulation material for storage device and bundling and sealing method of thermal insulation material
  • Storage device, thermal insulation material for storage device and bundling and sealing method of thermal insulation material

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Embodiment Construction

[0033] In order to further understand the content of the present invention, the present invention will be described in detail in conjunction with the accompanying drawings and embodiments.

[0034] to combine figure 1 In this embodiment, a heat insulating material for a storage device includes a heat insulating layer 100, and the heat insulating layer 100 is covered with a barrier layer 110, and the barrier layer 110 is formed by shrinking a heat shrinkable film.

[0035] The heat insulation material in the prior art is usually made of pressed nano-materials, which is easy to break and generate dust. When it is used in the car storage, the heat insulation material is often broken due to the vibration of the vehicle, resulting in powder leakage. The particles of the leaked powder material are small, and it is easy to enter the core module of the memory, affecting the working performance of the memory, and the leaked dust will also pollute the environment and bring safety hazard...

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Abstract

The invention discloses a memory, a thermal insulation material for the memory and a bundling and sealing method of the thermal insulation material, and belongs to the technical field of memories. Thethermal insulation material comprises a thermal insulation layer, the thermal insulation layer is coated with a barrier layer, and the barrier layer is formed by thermal shrinkage of a thermal shrinkage film. The thermal insulation material for the memory is arranged among the memory, the storage medium and the protective shell. According to the bundle sealing method for the thermal insulation material for the memory, the thermal insulation layer is put into a thermal shrinkage bag with the thickness of 10-25 microns and sealed, and a full-automatic thermal shrinkage film packaging machine isused for carrying out thermal shrinkage packaging on the thermal insulation layer so as to coat the surface of the thermal insulation layer with a barrier layer. The defect that a heat insulation material is prone to breakage and powder leakage is overcome, the heat insulation material for the storage is provided, the blocking layer can effectively separate the heat insulation layer from the outside, and the powder leakage phenomenon caused by vibration of the heat insulation layer is avoided. The memory provided by the invention has good safety stability and protection performance. Accordingto the heat insulation material bundle sealing method, heat insulation material bundle sealing can be quickly achieved, and the operation process is easy and convenient to control.

Description

technical field [0001] The invention belongs to the technical field of data memory production and processing, and more specifically relates to a memory, a heat insulating material for the memory and a bundling method thereof. Background technique [0002] A memory is generally composed of a recording medium, a protective casing, and a thermal insulation material, wherein the thermal insulation material is generally filled between the protective casing and the recording medium to prevent stored data from being damaged in an accident. In the event of an accident, the heat insulation material in the storage must meet the heat insulation requirements stipulated in the accident surviving requirements, that is, withstand a certain period of high-temperature fire and heating process, and ensure that the temperature of the internal storage medium is less than a certain temperature. Therefore, heat insulation The role of materials in memory is very important. [0003] In order to im...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G11B33/14B32B27/32B32B27/08B32B27/06B32B33/00
CPCB32B27/06B32B27/08B32B27/32B32B33/00B32B2307/304B32B2307/31B32B2307/5825G11B33/1406G11B33/1446
Inventor 林万才刘斌李明伟马志强
Owner JIANGSU DU WAN ELECTRONICS TECH CO LTD
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