A thin-film bulk acoustic resonator and its manufacturing process

A thin-film bulk acoustic wave and manufacturing process technology, applied in impedance networks, electrical components, etc., can solve problems such as difficulty in suppressing parasitic oscillations, affecting device performance, and taking away energy, so as to suppress shear waves and take away energy, simple process, and improved Q effect of value

Active Publication Date: 2021-10-15
HANGZHOU JWL TECH INC
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to solve the technical problem that the shear wave at the resonant region above the resonator cavity in the prior art is easy to leak from the edge of the resonator and take away energy, it is difficult to suppress parasitic oscillation, and affect the performance of the device, the present invention proposes a thin film bulk acoustic resonator and Its manufacturing process is used to solve the above problems

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A thin-film bulk acoustic resonator and its manufacturing process
  • A thin-film bulk acoustic resonator and its manufacturing process
  • A thin-film bulk acoustic resonator and its manufacturing process

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0038] The application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain related inventions, rather than to limit the invention. It should also be noted that, for the convenience of description, only the parts related to the related invention are shown in the drawings.

[0039] It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and embodiments.

[0040] figure 1 shows a cross-sectional view of a thin film bulk acoustic resonator according to an embodiment of the present invention, as figure 1 As shown, the thin film bulk acoustic resonator includes a substrate 101, a support layer 102, a bottom electrode 103, a piez...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

A thin film bulk acoustic resonator is disclosed, comprising a bottom electrode layer, a piezoelectric layer and a top electrode layer arranged on the upper part of the substrate where the acoustic wave reflection structure is located, wherein the part of the piezoelectric layer corresponding to the boundary of the acoustic wave reflection structure passes through the retrograde Polarization treatment to form a depolarized portion. Also disclosed is a manufacturing process of a thin film bulk acoustic resonator, comprising making a bottom electrode layer on a substrate on which an acoustic wave reflection structure is formed or to be formed to cover the acoustic wave reflection structure; making a piezoelectric layer on the bottom electrode layer; The part of the layer corresponding to the boundary of the acoustic wave reflection structure is depolarized to form a depolarized part; and the top electrode layer is made on the piezoelectric layer. The thin-film bulk acoustic resonator and its manufacturing process can inhibit the shear wave from taking energy away from the resonant area above the cavity of the resonator, thereby ensuring the mechanical vibration strength of the resonant area, suppressing parasitic oscillation, and improving the Q value of the resonator.

Description

technical field [0001] This application relates to the field of communication devices, and mainly relates to a thin film bulk acoustic wave resonator and its manufacturing process. Background technique [0002] With the increasingly crowded electromagnetic spectrum and the increase of frequency bands and functions of wireless communication equipment, the electromagnetic spectrum used by wireless communication has grown rapidly from 500MHz to above 5GHz. Therefore, there is a demand for RF front-end modules with high performance, low cost, low power consumption, and small size. also growing. The filter is one of the RF front-end modules, which can improve the transmitted and received signals, and is mainly composed of multiple resonators connected through a topology network structure. Fbar (Thin film bulk acoustic resonator) is a bulk acoustic resonator. The filter composed of it has the advantages of small size, strong integration capability, high quality factor Q when work...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): H03H3/02H03H9/02H03H9/13H03H9/17
CPCH03H3/02H03H9/02125H03H9/02H03H9/131H03H9/174H03H2003/023H03H2003/028H03H2009/02173H03H9/02118H03H9/02015H03H9/02047H03H9/0561H03H9/605H03H2003/021H03H2003/025H03H9/587H03H9/588H03H9/589H03H9/175H03H9/133H03H9/173H03H9/54
Inventor 李林萍盛荆浩江舟
Owner HANGZHOU JWL TECH INC
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products