Liquid-gas shunting type heat dissipation module

Abstract

The invention belongs to the field of heat dissipation modules and relates to a liquid-gas shunting type heat dissipation module. The module comprises a heat dissipation plate, wherein a condensationarea is arranged on the heat dissipation plate, a heat dissipation pipeline is arranged in the condensation area, the heat dissipation pipe can be formed through a punch forming and brazing process ora hot rolling blowing process, a heat dissipation plate surface is provided with hollow pipeline spaces which are respectively set as condensation areas, refrigerants are arranged in the condensationarea, the condensation area is provided with at least one steam channel and at least one liquid backflow channel, a heat dissipation pipe is arranged on a bottom surface of the heat dissipation platein an attached mode, the heat dissipation pipe and a steam channel are communicated through a connecting assembly, the heat dissipation pipe and the liquid backflow channel are communicated through aconnecting assembly, and complete circulation is formed. The module is advantaged in that the product is reasonable and ingenious in structure, the heat dissipation pipe is arranged on a bottom surface of the heat dissipation plate, the heat dissipation pipe is communicated with the condensation area of the heat dissipation plate through the tee joint and the guide pipe, and the structure effectively solves a problem that a pipeline is blocked when the heat dissipation plate is bent. Compared with the prior art, performance of the product is greatly improved, the weight of the product is light, and manufacturing cost of the product is low.

Description

Technical field [0001] The invention belongs to the technical field of heat dissipation of electronic products, and relates to a liquid-gas split-type heat dissipation module. Background technique [0002] At present, the TV side light heat dissipation structure on the market is formed with 2.5-3mm aluminum material, and the product weight is relatively large. As the power of the TV gradually increases, the performance of the aluminum substrate is slowly unable to meet customer needs. To solve the above problems, an improved solution is to set up a pipe on the bottom surface of the heat sink. The pipe and the condensing area inside the heat sink form a circulation structure. The bottom of the heat sink is bent and communicates with the pipe. The technical problem of this structure is When the heat sink is bent, it will block the pipe. At present, the bending of the two-phase flow heat dissipation scheme needs to increase the R angle at the bending position to ensure the smooth f...

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Problems solved by technology

[0002] At present, the side light heat dissipation structure of TVs on the market is formed by 2.5-3mm aluminum material, and the weight of the product is relatively large. With the gradual increase of TV power, the performance of aluminum substrates gradually cannot meet customer needs.

In view of the above problems, an improvement scheme proposed is to install pipes on the bottom of the heat sink. The pipes and the internal condensation area of ​​the heat sink form a circulation structure. The bottom of the heat sink is bent and connected to the pipes. The technical problems of this structure are: When the cooling plate is bent, it will block the pipe

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