Mixed wettability micro-nano composite enhanced heat transfer structure and preparation method of the structure
A technology of micro-nano composite and enhanced heat exchange, applied in the direction of semiconductor/solid-state device parts, semiconductor devices, electrical components, etc., can solve the problem of not considering hydrophilic and hydrophobic wetting properties, limited boiling heat transfer performance in high heat flux density pools, etc. , to achieve the effect of delayed boiling and dry burning, low wall superheat, and efficient heat exchange.
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[0036] Embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although certain embodiments of the invention are shown in the drawings, it should be understood that the invention may be embodied in various forms and should not be construed as limited to the embodiments set forth herein; A more thorough and complete understanding of the present invention. It should be understood that the drawings and embodiments of the present invention are for exemplary purposes only, and are not intended to limit the protection scope of the present invention.
[0037] It should be noted that concepts such as "first" and "second" mentioned in the present invention are only used to distinguish different devices, modules or units, and are not used to limit the sequence of functions performed by these devices, modules or units or interdependence.
[0038] It should be noted that the modifications of "one" and "multiple" mentioned ...
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