heat sink

Abstract

The present invention provides a heat sink that can obtain a heat receiving part, a heat insulating part, and a heat dissipation part even in an environment where the installation space of the heat sink, especially the installation space in the height direction of the heat sink is limited. While the volume is large enough, the heat sink area of ​​the heat sink is increased. The radiator includes: a heat transfer component with a heat receiving part thermally connected to the heating element; a pipe body connected to the heat dissipation part of the heat transfer part; , the heat transfer component has an integrated internal space that communicates from the heat receiving portion to the connecting portion connected to the pipe body and encloses a working fluid, the internal space of the heat transfer component is connected to the internal space of the pipe body The cross-sectional area of ​​the internal space of the heat dissipation part in a direction perpendicular to the heat transfer direction of the heat transfer part is smaller than the cross-sectional area of ​​the heat insulating part between the heat receiving part and the heat dissipation part.

Description

technical field [0001] The present invention relates to a heat sink for cooling electric / electronic parts and the like. Background technique [0002] As electronic devices become more functional, electronic devices include heating elements such as electronic components, and many components are mounted at high density. In addition, as electronic devices become more functional, the amount of heat generated by heating elements such as electronic components increases. A heat sink may be used as means for cooling a heat generating body such as an electronic component. As the heat sink, generally, a heat pipe type heat sink including a tubular heat pipe is used. [0003] As a heat pipe type heat sink, for example, there is a heat pipe type heat sink in which a plurality of flat fins protrude from an outer peripheral surface provided with a plurality of tubular heat pipes (Patent Document 1). The heat pipe radiator of Patent Document 1 is a radiator that cools the heat generatin...

AI Technical Summary

Problems solved by technology

That is, in the heat pipe type radiator, there is room for improvement in terms of space saving of the radiator and improvement of cooling performance

[0006] In addition, there is a chamfer on the outer peripheral surface of each heat pipe, and the gap generated outside the chamfer does not help the heat transfer of the heat pipe group, so the volume of the heat receiving part, heat insulation part and heat dissipation part of the heat pipe group cannot be made large enough, There are still cases where sufficient cooling performance cannot be obtained

[0007] Furthermore, if a heat pipe group composed of a plurality of heat pipes is thermally connected to a heat generating body, the amount of heat received by the heat pipes varies according to the distance from the heat generating body.

Therefore, the heat input to the heat receiving part of the heat pipe group cannot be sufficiently uniformed, and since the thermal resistance between the heat receiving part of the heat pipe group and the heat generating body increases, there is a problem that a sufficient improvement in cooling performance cannot be achieved.

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