Air treatment system and method for cooling resin slices

An air handling system and resin slicing technology, applied in the field of resin processing, can solve the problem that the cooling capacity of the air inlet cooling unit cannot meet the needs of high-load production, etc.

Inactive Publication Date: 2020-10-30
YINGKOU KANGHUI PETROCHEM
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The invention provides an air treatment system and method for cooling resin slices to solve the pro...

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  • Air treatment system and method for cooling resin slices
  • Air treatment system and method for cooling resin slices
  • Air treatment system and method for cooling resin slices

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Embodiment Construction

[0032] Please refer to the attached Figure 1-3 , with figure 1 It shows the front view of the air handling system for cooling the resin chips provided by the embodiment of the present application, and the attached figure 2 Shows the embodiment provided by the application figure 1 Top view of the middle and upper floors, with image 3 Shows the embodiment provided by the application figure 1 A top view of the middle and lower floors. attached by Figure 1-3 It can be seen that the air treatment system for cooling resin chips provided by the embodiment of the present application includes a louver section 1 , a filter section 2 , a steam heating section 3 , a cooling section 4 and a dehumidification section 5 . The air treatment system provided by the embodiment of the present application will be described in detail below with reference to the accompanying drawings.

[0033] Specifically, the louver section 1 is a component for coarsely filtering air. The main part of th...

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Abstract

The invention provides an air treatment system and method for cooling resin slices. The system comprises a shutter section, a filtering section, a steam heating section, a cooling section and a dehumidifying section, wherein the filtering section comprises a primary-effect filtering section and a medium-effect filtering section, and the steam heating section comprises a first steam heating sectionand a second steam heating section; the primary-effect filtering section is positioned between the shutter section and the first steam heating section; the cooling section is positioned between the dehumidifying section and the first steam heating section; the second steam heating section is positioned between the dehumidifying section and the medium-efficiency filtering section; the medium-efficiency filtering section is communicated with an air outlet. The system can perform primary filtration, heating, cooling, dehumidification, constant temperature and medium-efficiency filtration on air,realizes integration of cooling, dehumidification, filtration and constant temperature operation, improves the practicability of the system, and can realize stable operation in a special environmentor under special conditions. The air treatment system has high cooling capacity, the cooling temperature is stable and only fluctuates at about+/-4 DEG C, and 110%-150% load stable operation of productivity can be achieved.

Description

technical field [0001] The invention relates to the technical field of resin processing, in particular to an air treatment system and method for cooling resin slices. Background technique [0002] Solid-state polycondensation refers to the polycondensation reaction of monomers or prepolymers under solid-state conditions. During the process of forming PBT (English name: polybutyleneterephthalate; Chinese name: polybutylene terephthalate) resin slices through solid-state polycondensation reaction, the high-viscosity resin slices after the reaction in the reactor still have a very high temperature. It needs to be cooled before packing. [0003] In the solid-state polycondensation process, the high-temperature chips are usually cooled by the outdoor air processed by the air inlet cooling unit. Therefore, the temperature of the outdoor air processed by the air inlet cooling unit has a great influence on the cooling temperature of the chips, and the quality of the chips Also rel...

Claims

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Application Information

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IPC IPC(8): B01D46/12B01D53/26
CPCB01D46/12B01D53/26B01D2257/80B01D2258/06
Inventor 张伟聂方元
Owner YINGKOU KANGHUI PETROCHEM
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