Semiconductor refrigerating and heating automobile air conditioner

A technology of refrigeration, heating and automobile air conditioning, which is applied to vehicle parts, air handling equipment, heating/cooling equipment, etc., can solve the problems of high component cost and limited use, and achieve the effect of small size, cost saving and compact size

Inactive Publication Date: 2020-11-03
湖南圣芯超能环保科技有限公司
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  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, the galvanic stack components used are made of high-purity rare materials, and the process conditions are not yet mature, resulting in relatively high cost of components, which greatly limits the wide application in the field of general refrigeration

Method used

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  • Semiconductor refrigerating and heating automobile air conditioner
  • Semiconductor refrigerating and heating automobile air conditioner
  • Semiconductor refrigerating and heating automobile air conditioner

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Embodiment Construction

[0040] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0041] see Figure 1-7 , the present invention provides a technical solution: a semiconductor refrigeration and heating automobile air conditioner, image 3 It is a three-dimensional schematic diagram of a double-body combined component, wherein the first water-cooled head 9 of the same property is placed at both ends of the component device, and the second water-cooled head 4 of the same property is placed in the parallel center of the double-body combined co...

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Abstract

The invention discloses a semiconductor refrigeration and heating automobile air conditioner, and the air conditioner comprises a first semiconductor refrigeration sheet, wherein a metal heat conduction plate is fixedly installed on one side of the first semiconductor refrigeration sheet, and a second semiconductor refrigeration sheet is fixedly installed on one side of the metal heat conduction plate. According to the semiconductor refrigeration and heating automobile air conditioner, the semiconductor refrigeration efficiency problem is solved, and large-scale refrigeration can be achieved;therefore, by means of the advantage that an automobile has a direct-current power source, the cost of a direct-current power source device is saved, much cost of the semiconductor refrigeration and heating automobile air conditioner can be reduced, and the semiconductor heating efficiency is permanently larger than 1; the energy efficiency ratio is generally between 1 and 2, if the heat exchangeprocess is optimized and an overlapping scheme is adopted, it is possible that the refrigerating efficiency is close to that of a traditional compressor, and if the optimal value of the semiconductormaterial is further improved in the future, the refrigerating efficiency can further exceed that of the traditional compressor.

Description

technical field [0001] The invention relates to the technical field of electronic machinery, in particular to a semiconductor refrigeration and heating automobile air conditioner. Background technique [0002] A piece of N-type semiconductor material and a piece of P-type semiconductor material are connected to form a galvanic stack, and many galvanic stacks are connected in series to form a semiconductor cooling chip. In principle, the peltier is a tool for heat transfer. When a current flows through a thermocouple pair formed by connecting an N-type semiconductor material and a P-type semiconductor material, heat transfer will occur between the two ends, and the heat will be transferred from one end to the other end, thereby generating a temperature difference to form cold and heat. end. However, the semiconductor itself has resistance. When the current passes through the semiconductor, heat will be generated, which will affect the heat transfer. Moreover, the heat betw...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B60H1/00B60H1/32
CPCB60H1/00478B60H1/32
Inventor 刘小江孟兵郑亚国
Owner 湖南圣芯超能环保科技有限公司
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