High-power chip routing and packaging device

A packaging device and chip bonding technology, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of reducing the production efficiency of enterprises, inconvenient normal production of enterprises, and slow cooling speed, so as to improve practicability, cooling The effect of fast speed and accelerated air velocity

Active Publication Date: 2020-11-03
广东金田半导体科技有限公司
View PDF6 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The object of the present invention is to provide a high-power chip wire-bonding packaging device, which has the advantage of fast cooling speed, and solves the shortcomings of the existing high-power chip wire-bonding packaging device during use. The high-power chip wire bonding packaging device has a low processing rate during the processing process, which reduces the production efficiency of the enterprise and is not convenient for the normal production of the enterprise.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • High-power chip routing and packaging device
  • High-power chip routing and packaging device
  • High-power chip routing and packaging device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Embodiment 1: A high-power chip wire bonding packaging device, including a packaging device body 1, the four corners of the bottom of the packaging device body 1 are fixedly connected with anti-slip pads, and the bottom of the anti-slip pad is provided with anti-skid lines, through which the four corners of the bottom of the packaging device body 1 The setting of the anti-skid pad improves the stability of the packaging device body 1. The top of the packaging device body 1 is provided with a cavity 2, and the inner cavity of the cavity 2 is provided with an air-cooling structure 3. The air-cooling structure 3 includes a The mounting bracket 31 of the inner cavity, the front surface of the mounting bracket 31 is provided with a mounting hole 32, the inner cavity of the mounting hole 32 is fixedly connected with a fixed frame 33, and the inner cavity of the fixed frame 33 is fixedly connected with a motor 34, and the output shaft of the motor 34 is fixed. The fan blade 35 ...

Embodiment 2

[0026]Embodiment 2: A high-power chip wire bonding packaging device, including a packaging device body 1, the four corners of the bottom of the packaging device body 1 are fixedly connected with anti-slip pads, the bottom of the anti-slip pad is provided with anti-slip lines, and the top of the packaging device body 1 is opened There is a cavity 2, the inner cavity of the cavity 2 is provided with an air-cooling structure 3, the air-cooling structure 3 includes a mounting frame 31 located in the cavity of the cavity 2, and the front surface of the mounting frame 31 is provided with a mounting hole 32, and the mounting hole 32 The inner chamber of the fixed mount 33 is fixedly connected with a fixed frame 33, the inner cavity of the fixed frame 33 is fixedly connected with a motor 34, and the output shaft of the motor 34 is fixedly connected with a fan blade 35, through the mounting frame 31, the mounting hole 32, the fixed frame 33, the motor 34 and The cooperative use of the f...

Embodiment 3

[0027] Embodiment 3: A high-power chip wire bonding packaging device, including a packaging device body 1, the four corners of the bottom of the packaging device body 1 are fixedly connected with anti-slip pads, and the bottom of the anti-slip pad is provided with anti-skid lines, through which the four corners of the bottom of the packaging device body 1 The setting of the anti-skid pad improves the stability of the packaging device body 1. The top of the packaging device body 1 is provided with a cavity 2, and the inner cavity of the cavity 2 is provided with an air-cooling structure 3. The air-cooling structure 3 includes a The mounting bracket 31 of the inner cavity, the front surface of the mounting bracket 31 is provided with a mounting hole 32, the inner cavity of the mounting hole 32 is fixedly connected with a fixed frame 33, and the inner cavity of the fixed frame 33 is fixedly connected with a motor 34, and the output shaft of the motor 34 is fixed. The fan blade 35 ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a high-power chip routing and packaging device. The device comprises a packaging device body, a cavity is formed at the top of the packaging device body, an air cooling structure is arranged in an inner cavity of the cavity, mounting cavities are formed at the two sides of the inner cavity of the air cooling structure, connecting plates are fixedly connected to the two sides of the air cooling structure, and an electric telescopic rod is fixedly connected to the bottom of an inner cavity of the mounting cavity. The electric telescopic rod is used for generating power for moving up and down to drive the air cooling structure to stretch out and draw back in the inner cavity of the cavity, and a motor fixed in the air cooling structure is used for driving the fan blades to rotate, so that the effect of increasing the air flow speed is achieved; air flow is used for taking away the heat generated during chip packaging, so that the heat dissipation effect is achieved. The high-power chip routing and packaging device has the advantage of being high in cooling speed, heat generated in the chip packaging process can be rapidly dissipated according to needs in the machining process, and the effect of cooling the surface of a chip is achieved.

Description

technical field [0001] The invention relates to the technical field of chip packaging, in particular to a high-power chip wire bonding packaging device. Background technique [0002] The shell used to install the semiconductor integrated circuit chip plays the role of placing, fixing, sealing, protecting the chip and enhancing the electrothermal performance, and it is also a bridge to communicate the internal world of the chip with the external circuit - the contacts on the chip are connected to the packaging shell with wires On the pins, these pins are connected to other devices through the wires on the printed board. Therefore, the package plays an important role for the CPU and other LSI integrated circuits. Epoxy resin (generally epoxy resin doped with silver particles) covers the placement point of the silicon chip, and then the silicon chip is directly placed on the surface of the substrate, heat-treated until the silicon chip is firmly fixed on the substrate, and then...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H01L21/67
CPCH01L21/67109H01L21/67121
Inventor 林德辉陈春利许伟波姚小铭周秋逢
Owner 广东金田半导体科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap