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CSP-based MEMS infrared temperature measurement sensor and production process thereof

A technology of infrared temperature measurement and production process, which is applied in the field of CSP-based MEMS infrared temperature measurement sensor, can solve the problems of increased cost and hardware design difficulty, limited application scene space, and single temperature measurement function, so as to ensure the sealing performance and Cleanliness, expanding the scope of application, and improving production efficiency

Pending Publication Date: 2020-11-10
NEOMEMS TECH INC WUXI CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the infrared sensor adopts TO46 packaging method and only has a single temperature measurement function. It only contains MEMS thermopile chips, NTC resistors for temperature compensation, and 5.5um long-pass filters. It can only output analog signals and has poor anti-interference ability. An additional ADC is required for analog-to-digital conversion, which increases the cost and difficulty of hardware design, and some application scenarios are limited in space

Method used

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  • CSP-based MEMS infrared temperature measurement sensor and production process thereof
  • CSP-based MEMS infrared temperature measurement sensor and production process thereof
  • CSP-based MEMS infrared temperature measurement sensor and production process thereof

Examples

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Embodiment

[0036] Embodiment: a kind of MEMS infrared temperature measuring sensor based on CSP, as figure 1 and figure 2 As shown, it includes PCB substrate 1, on which MEMS thermopile 2, NTC resistor 3, resistance capacitance 4 and ADC5 are arranged, ADC5 is used to convert the voltage signal of MEMS thermopile 2 into a digital signal, PCB substrate 1. The outer casing is provided with a resin case 6, and an opening located directly above the MEMS thermopile 2 is opened on the resin case 6, and a long-pass infrared lens 7 covering the opening is embedded in the resin case 6.

[0037] MEMS thermopile 2 is composed of multiple thermocouples. When the infrared light irradiation temperature within the sensor detection range has a certain value change, the thermocouples generate charges, that is, a weak voltage difference is generated between the two electrodes. The MEMS thermopile 2 sensor detects the changing temperature, and after photoelectric conversion, it becomes a voltage signal, ...

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PUM

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Abstract

The invention relates to an infrared temperature measurement sensor which has the effects of function integration and wide application scenarios. The CSP-based MEMS infrared temperature measurement sensor comprises a PCB substrate; an MEMS thermopile, an NTC resistor, a resistor-capacitor and an ADC are arranged on the PCB substrate; the ADC is used for converting a voltage signal of the MEMS thermopile into a digital signal, the PCB substrate is sleeved with a resin shell, and an opening located over the MEMS thermopile is formed in the resin shell. A long-pass infrared lens covering the opening is embedded in the resin shell. By means of the cooperation of the CSP packaging technology and the ADC, the integrated arrangement of the ADC and the MEMS thermopile is achieved, and the application range of the infrared temperature measurement sensor is expanded.

Description

technical field [0001] The invention relates to an infrared temperature measuring sensor, more specifically, it relates to a CSP-based MEMS infrared temperature measuring sensor. Background technique [0002] Non-contact infrared temperature measurement is also called radiation temperature measurement, which generally uses pyroelectric or photoelectric detectors as detection elements. This temperature measurement system is relatively simple, it can realize the temperature measurement of a large area, and it can also be the temperature measurement of a certain point on the measured object. [0003] At present, the infrared sensor adopts TO46 packaging method and only has a single temperature measurement function. It only contains MEMS thermopile chips, NTC resistors for temperature compensation, and 5.5um long-pass filters. It can only output analog signals and has poor anti-interference ability. Additional ADC is required for analog-to-digital conversion, which increases th...

Claims

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Application Information

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IPC IPC(8): G01J5/14B81C3/00
CPCB81C3/001B81C2203/01G01J5/14
Inventor 朱磊魏冬周晓瑜
Owner NEOMEMS TECH INC WUXI CHINA
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