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Manufacturing method of display panel and display panel

A manufacturing method and display panel technology, applied in the manufacture of display panels and in the field of display panels, can solve the problems of high pollution and high energy consumption in electroplating

Pending Publication Date: 2020-11-10
CHUZHOU HKC OPTOELECTRONICS TECH CO LTD +1
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The purpose of this application is to provide a method for manufacturing a display panel and a display panel, which are energy-saving and environmentally friendly, and improve the problem of high pollution and high energy consumption in electroplating

Method used

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  • Manufacturing method of display panel and display panel
  • Manufacturing method of display panel and display panel
  • Manufacturing method of display panel and display panel

Examples

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Embodiment Construction

[0057]It should be understood that the terminology and specific structural and functional details disclosed herein are representative only for describing specific embodiments, but the application can be embodied in many alternative forms and should not be construed as merely Be limited by the examples set forth herein.

[0058] In the description of the present application, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating relative importance, or implicitly indicating the quantity of indicated technical features. Therefore, unless otherwise specified, the features defined as "first" and "second" may explicitly or implicitly include one or more of these features; "plurality" means two or more. The term "comprising" and any variations thereof mean non-exclusive inclusion, possible presence or addition of one or more other features, integers, steps, operations, units, components and / or combinations thereof.

[0059] Als...

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Abstract

The invention discloses a manufacturing method of a display panel and the display panel. The manufacturing method comprises a manufacturing process of forming an array substrate, and the manufacturingprocess of forming the array substrate comprises the following steps: forming a buffer layer on a glass substrate; forming a photoresist layer on the buffer layer; putting the substrate on which thephotoresist layer is formed into an activating agent for activating treatment, wherein an activating solution particle layer with a first preset pattern is formed at a corresponding position where theactivating agent is in contact with the photoresist layer, and an activation liquid particle layer with a second preset pattern is formed at a corresponding position where the activator is in contactwith the buffer layer; removing the photoresist layer and forming an activation liquid particle layer of a first preset pattern; and carrying out chemical plating operation to form a first metal layer corresponding to the position of the activation solution particle layer of the second preset pattern in contact with the buffer layer. In the scheme, due to the fact that chemical plating operationis used and electrification is not needed, the first metal layer is formed, energy conservation and environmental protection are achieved, and the problems of high pollution and high energy consumption of electroplating are solved.

Description

technical field [0001] The present application relates to the field of display technology, in particular to a method for manufacturing a display panel and the display panel. Background technique [0002] In the display panel, the display panel includes a TFT (Thin Film Transistor, thin film transistor), wherein the TFT includes a gate, a source and a drain, and the gate, the source and the drain are made of metal, usually Al (aluminum ), Al / Mo (aluminum / molybdenum), Al / Ti (aluminum / titanium), etc., but with the increasing demand for display panels, it is difficult for Al to meet the needs of fast electrons due to its low conductivity. Transmission requirements, Cu (copper) process has become the development trend and process requirements of the next generation of TFT due to its many advantages. [0003] The copper metal layer is usually made by electroplating. First, an electrode pattern is formed on the substrate as a buffer layer, and then copper metal is plated on the bu...

Claims

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Application Information

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IPC IPC(8): H01L21/336H01L29/78
CPCH01L29/66742H01L29/78636H01L29/78606C23C18/1608C23C18/40C23C18/1879H01L27/1288H01L27/124C23C18/1689G03F7/0007H01L27/1218H01L27/1262H01L27/1292G02F1/1368G02F2201/07H01L21/288G02F1/13629G02F1/136295
Inventor 夏玉明叶利丹
Owner CHUZHOU HKC OPTOELECTRONICS TECH CO LTD
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