Semiconductor silicon wafer etching device

Abstract

The invention relates to the technical field of silicon wafer etching, and discloses a semiconductor silicon wafer etching device which comprises a box body, supporting legs are fixedly connected to the lower surface of the box body; a bearing groove is fixedly connected to the bottom of the front surface of the box body, locking devices are arranged on the left side and the right side of the front surface of the box body, and a circulating pump is fixedly connected to the upper surface of the box body; the output end of the circulating pump is sleeved with a flow dividing pipe, and a connecting hose is inserted into the outer side face of the flow dividing pipe. According to the semiconductor silicon wafer etching device, the first fixed block, the second circular shaft, the first transmission shaft, the second fixed block, the third circular shaft, the transmission rod and the motor are arranged, so the second transmission shaft can conveniently drive the spray head to spray and etcha semiconductor silicon wafer, and the processing time is shortened, so the etching liquid can be uniformly sprayed on the upper surface of the semiconductor silicon wafer, and the semiconductor silicon wafer can react more conveniently and is more convenient to use.

Description

technical field [0001] The invention relates to the technical field of silicon wafer etching, in particular to a semiconductor silicon wafer etching device. Background technique [0002] Etching is the technique of removing material using chemical reaction or physical impact. Etching technology can be divided into wet etching and dry etching. Etching was first used to manufacture copper plates, zinc plates and other printing concave-convex plates, and is also widely used to reduce weight instrument panels, nameplates and thin workpieces that are difficult to process by traditional processing methods. etc.; through continuous improvement and development of process equipment, it can also be used for the processing of precision etching products of electronic sheet parts in aviation, machinery, and chemical industries; especially in semiconductor manufacturing processes, etching is an indispensable technology; existing technology Most of the semiconductor silicon chip etching d...

AI Technical Summary

Problems solved by technology

Etching technology can be divided into wet etching and dry etching. Etching was first used to manufacture copper plates, zinc plates and other printing concave-convex plates, and is also widely used to reduce weight instrument panels, nameplates and thin workpieces that are difficult to process by traditional processing methods. etc.; through continuous improvement and development of process equipment, it can also be used for the processing of precision etching products of electronic sheet parts in aviation, machinery, and chemical industries; especially in semiconductor manufacturing processes, etching is an indispensable technology; existing technology Most semiconductor silicon wafer etching devices are used to place semiconductor silicon wafers in the etching solution, which has low working efficiency, prolongs the processing time, and the reaction is not sufficient, which will cause waste and is inconvenient to use.

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