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Femtosecond laser processing system and method for realizing polyimide ablation or carbonization

A femtosecond laser processing and femtosecond laser technology, applied in the field of femtosecond laser applications, can solve the problems of inaccurate repositioning, inability to meet ablation and carbonization, and secondary clamping.

Active Publication Date: 2020-11-13
TSINGHUA UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the structure to be processed requires both oscillating pole laser and amplifying pole laser processing, the material needs to be transferred between the two processing systems, which affects the continuity of the processing process, and may also cause inaccurate secondary clamping and repositioning and other problems, which bring inconvenience to the processing, and cannot meet the needs of continuous ablation and carbonization of PI in the process of microcircuit processing

Method used

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  • Femtosecond laser processing system and method for realizing polyimide ablation or carbonization
  • Femtosecond laser processing system and method for realizing polyimide ablation or carbonization
  • Femtosecond laser processing system and method for realizing polyimide ablation or carbonization

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Experimental program
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Effect test

Embodiment 1

[0030] Dot processing of ablation and removal properties is performed on the surface of PI sample 16. First, femtosecond laser 1 is turned on to generate femtosecond laser, and computer 21 is used to control the moving position of one-dimensional translation stage 10, so that the amplifier laser is reflected by fourth mirror 9. Adjust the laser power through the first attenuation sheet 2, so that the laser flux is 1.2J / cm 2 , adjust the spot size to 8mm through the first aperture 3; turn on the illuminating lamp 19, adjust the position of the CCD 20 so that it can image clearly; adjust the position of the processing objective lens 15 to focus the femtosecond laser on the surface of the PI sample 16. Use the computer 21 to set the opening time of the electronically controlled shutter 13 to 100 ms, open the shutter, so that the surface of the PI sample 16 produces an ablation processing effect; use the computer 21 to control the six-dimensional translation stage 17 to translate 5...

Embodiment 2

[0033] Carry out carbonization scanning line on the surface of PI sample 16, process continuous carbonization structure, first turn on femtosecond laser 1 to generate femtosecond laser, use computer 21 to control the moving position of one-dimensional translation stage 10, so that the oscillator laser is reflected by the fourth mirror 9 . Regulating the laser power by the second attenuation plate 6 is 80mW, and the spot size is 8mm by the second diaphragm 7; Turn on the illuminator 19, adjust the position of the CCD 20 so that it can be clearly imaged; adjust the position of the processing objective lens 15 to make the femtosecond The laser is focused on the surface of PI sample 16 . Use the computer 21 to set the electronically controlled shutter 13 as a continuous open mode, and set the translation speed of the six-dimensional translation stage 17 to 1000 μm / s; open the shutter to make the surface of the PI sample 16 produce the effect of carbonization and sweeping lines; us...

Embodiment 3

[0036] Process the interdigitated microcapacitor on the surface of PI sample 16, first turn on the femtosecond laser 1 to generate femtosecond laser, and adjust the laser flux of the amplifier to 1.2J / cm through the first attenuator 2 2 , adjust the spot size to 8mm through the first aperture 3; adjust the oscillatory laser power to 60mW through the second attenuation plate 6, adjust the spot size to 8mm through the second aperture 7; use the computer 21 to control the moving position of the one-dimensional translation stage 10 , so that the oscillating pole laser is reflected by the fourth mirror 9 . Turn on the illuminator 19, adjust the position of the CCD 20 so that it can image clearly; adjust the position of the processing objective lens 15 to focus the femtosecond laser on the surface of the PI sample 16. Use the computer 21 to set the electronically controlled shutter 13 to the continuous open mode, set the translation speed of the six-dimensional translation stage 17 ...

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Abstract

The invention belongs to the technical field of femtosecond laser application, and particularly relates to a femtosecond laser processing system and method for realizing polyimide ablation or carbonization. According to the femtosecond laser processing system and method, PI is precisely ablated and removed by using the characteristic of high laser peak power of an amplification pole, and the PI iscarbonized by using the thermal effect of oscillation pole laser. According to the system, parameter adjustment can be carried out on the amplification pole femtosecond laser and the oscillation polefemtosecond laser respectively, so that the ablation process and the carbonization process are controlled respectively, and mutual interference is avoided; by means of the system, the machining effect of the femtosecond laser on the PI can be rapidly and flexibly switched between the ablation removal mode and the carbonization mode, the ablation and carbonization effects are achieved according toneeds, and after an optical path system is built at a time, the optical path system is not needed to be adjusted in the machining process; and the advantages of convenience in light path system adjustment, high machining flexibility and wide machinable structure range are achieved, and a feasible scheme is provided for preparing PI surface microstructures and carbon-based microcircuits.

Description

technical field [0001] The invention belongs to the field of femtosecond laser application technology, and in particular relates to a femtosecond laser processing system and method for realizing polyimide ablation or carbonization. Background technique [0002] Polyimide (hereinafter referred to as PI) is a polymer insulator with mature manufacturing technology and excellent insulation, mechanical and thermal properties. It has been used as insulating tape for a long time and is widely used in the electrical industry. Because its molecular structure contains a benzene ring, a cracking reaction will occur under high temperature conditions to produce a carbon structure. Using this feature, the researchers found that PI is irradiated with laser beams, and the thermal effect of the laser can be used to carbonize PI, so that the area irradiated by the laser produces a carbon structure and has electrical conductivity, while the area not irradiated by the laser The illuminated are...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/362B23K26/064B23K26/067B23K26/70C01B32/05
CPCB23K26/0643B23K26/0673B23K26/362B23K26/064B23K26/702C01B32/05
Inventor 姜澜闫剑锋郭恒
Owner TSINGHUA UNIV
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