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A kind of aluminum nitride and aluminum oxide composite heat-conducting and insulating silica gel material and preparation method thereof

A technology of insulating silica gel and aluminum nitride, which is applied in the field of silica gel gaskets and its preparation, can solve problems such as insufficient thermal conductivity, and achieve the effects of improved thermal conductivity, good insulation, and improved thermal conductivity

Active Publication Date: 2022-04-19
SHENZHEN INST OF ADVANCED ELECTRONICS MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of the lack of thermal conductivity of existing insulating and heat-conducting gaskets, the purpose of the present invention is to provide a heat-conducting, insulating and heat-conducting silica gel gasket and its preparation method, and reasonably compound the ratio of aluminum nitride and aluminum oxide, thereby improving the thermal conductivity and making the product have High thermal conductivity and excellent insulation properties

Method used

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  • A kind of aluminum nitride and aluminum oxide composite heat-conducting and insulating silica gel material and preparation method thereof
  • A kind of aluminum nitride and aluminum oxide composite heat-conducting and insulating silica gel material and preparation method thereof
  • A kind of aluminum nitride and aluminum oxide composite heat-conducting and insulating silica gel material and preparation method thereof

Examples

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preparation example Construction

[0053] Another aspect of the present invention provides a method for preparing an insulating and heat-conducting silica gel material, which sequentially includes the following steps:

[0054] 1) Compounding aluminum nitride particles and alumina particles, adding a surfactant and heating and mixing to obtain a thermally conductive filler;

[0055] 2) In the mixture of polydimethylsiloxane, hydrogen-containing silicone oil, dimethyl silicone oil, and inhibitor, add thermally conductive filler, stir well, add catalyst, stir evenly, and obtain an insulating thermally conductive silicone material.

[0056] Preferably, the method of compounding aluminum nitride particles and alumina particles in step 1) is to mix and stir the aluminum nitride particles and alumina particles evenly, then add a mixture of surfactant and ethanol, and stir until the powder is wetted , continue to stir and heat up to 60-90°C, keep stirring, and heat up to 120-180°C, vacuumize to remove low molecules, an...

Embodiment 1

[0071] Example 1: A compound of aluminum nitride and aluminum oxide with high thermal conductivity, insulation and heat conduction silica gel gasket

[0072] The preparation method is:

[0073] 1) Aluminum nitride and alumina compound selection:

[0074]

[0075] Compound the above-mentioned aluminum nitride and alumina, mix and stir evenly, add a mixture of 24 parts of surfactant and 72 parts of ethanol, stir well until the powder is wetted, continue stirring and raise the temperature to 80°C, keep stirring After 4 hours, the temperature was raised to 150°C, the low molecules were removed in vacuum, and 2400 parts of the processed mixed powder were obtained;

[0076] 2) 100 parts of vinyl-terminated polydimethylsiloxane (100cps: 2000cps = 2:1), 6 parts of hydrogen-containing silicone oil (side hydrogen: terminal hydrogen = 2:1), 10 parts of 100cps dimethyl silicone oil 1. Put 0.1 part of inhibitor (acetylene cyclohexanol) into a kneader or a planetary mixer, add 2400 par...

Embodiment 2

[0079] Example 2: A compound of aluminum nitride and aluminum oxide with high thermal conductivity, insulation and heat conduction silica gel gasket

[0080] Its preparation method is:

[0081] 1) Aluminum nitride and alumina compound selection:

[0082]

[0083] Compound the above-mentioned aluminum nitride and alumina, mix and stir evenly, add a mixture of 26 parts of surfactant and 78 parts of ethanol, stir well until the powder is wetted, continue stirring and raise the temperature to 80°C, keep stirring After 4 hours, the temperature was raised to 150°C, the ethanol was removed in a vacuum, and 2600 parts of the treated mixed powder were obtained;

[0084] 2) 100 parts of vinyl-terminated polydimethylsiloxane (100cps: 2000cps = 2:1), 6 parts of hydrogen-containing silicone oil (side hydrogen: terminal hydrogen = 2:1), 10 parts of 100cps dimethyl silicone oil 1. Put 0.1 part of inhibitor (acetylene cyclohexanol) into a kneader or a planetary mixer, add 2600 parts of t...

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Abstract

The invention provides a heat-conducting and insulating silica gel material compounded with aluminum nitride and alumina and a preparation method thereof. An insulating and thermally conductive silica gel material, which includes an insulating silica gel matrix and a thermally conductive filler, the thermally conductive filler includes thermally conductive particles and a surfactant, wherein the thermally conductive particles are a combination of aluminum nitride particles and aluminum oxide particles, wherein the aluminum nitride particles The particle size is 20-100 μm, the particle size of the alumina particles is 1-30 μm, the particle size of the alumina particles is 1-30 μm, wherein the aluminum nitride particles account for 40%-60% of the total weight of the heat-conducting particles; preferably, nitrogen The particle size of the alumina particles is 30-80 μm, and the particle size of the alumina particles is 1-20 μm. The particles of the present invention are closely packed, and the ratio of aluminum nitride and aluminum oxide is reasonably compounded. After being treated with a surfactant, high filling of aluminum oxide and aluminum nitride can be realized, so that the thermal conductivity of the thermally conductive insulating silicone gasket can reach 15.0W / (m·K) or more.

Description

technical field [0001] The invention relates to a silica gel gasket and a preparation method thereof, in particular to an aluminum nitride-alumina composite high thermal conductivity insulating heat conduction silica gel gasket and a preparation method thereof. Background technique [0002] Statistics show that the reliability of electronic components will decrease by 10% for every 2°C increase in temperature, and the life of electronic components will double if the temperature decreases by 8°C; therefore, the role played by thermal interface materials in the field of information technology more and more important. How to further improve the thermal conductivity of thermal interface materials and reduce thermal resistance is still a very important issue faced by electronic packaging and heat dissipation engineering. [0003] Ordinary insulating and thermally conductive silicone sheets are made of aluminum oxide and silica gel, and the thermal conductivity generally does not...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L83/07C08L83/05C08L83/04C08K7/18C08J5/18C09K5/14
CPCC08J5/18C09K5/14C08J2383/07C08J2483/05C08J2483/04C08K7/18C08K2201/005C08K2201/014
Inventor 孙蓉张伟林曾小亮毛大厦许建斌
Owner SHENZHEN INST OF ADVANCED ELECTRONICS MATERIALS