Wafer assembly with alignment marks, method for forming same, and method for aligning wafers

Abstract

The present invention provides a wafer component with an alignment mark, its forming method, and a wafer alignment method. The alignment mark is distributed in the bonding layer and the dielectric layer of the first wafer and the second wafer, and the first In the wafer, the reflected light of the first dot-shaped mark and the first block-shaped mark are superimposed to ensure the pattern definition of the alignment mark. The first dot-shaped mark is located in the first bonding layer, and the second The upper surface of the dot-shaped mark is flush with the upper surface of the first bonding layer, and the first dot-shaped mark on the bonding surface ensures microscopic flatness, and there is no gap after bonding; at the same time, the first dot-shaped mark on the bonding surface The first dot mark also eliminates the overlay accuracy error between different layers. The second wafer is the same as the first wafer. The use of the alignment mark on the bonding machine can not only eliminate the overlay accuracy error between different layers, improve the definition of the pattern, but also solve the problem of bonding voids.

Description

technical field [0001] The invention belongs to the technical field of integrated circuit manufacturing, and in particular relates to a wafer component with an alignment mark and a forming method thereof. Background technique [0002] With the development of semiconductor VLSI, three-dimensional stacked packaging technology stacks silicon wafers through bonding technology to realize a metal interconnection structure on a three-dimensional level, which can reduce interconnection distances, increase transmission speeds, and reduce device volume. [0003] Wafer bonding technology is one of the important means to realize three-dimensional stacking. Wafer bonding technology includes hybrid bonding of metal layer to metal layer and dielectric layer to dielectric layer. Hybrid bonding can provide metal interconnection structure and sufficient mechanical support at the same time, and is one of the key technologies of three-dimensional stacking. [0004] When the upper and lower waf...

AI Technical Summary

Problems solved by technology

[0005] The object of the present invention is to provide a wafer assembly with alignment marks, its forming method, and wafer alignment method, which can improve the recognition ability of alignment marks, eliminate overlay accuracy errors between different layers, and improve pattern definition while Solving Bonding Void Issues

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