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Microphone structure and electronic device

A microphone and equipment technology, applied in the field of microphones, can solve the problems of small air volume in the back room, lower resonance frequency, and large air volume in the front room, so as to avoid the impact of frequency response performance, increase signal-to-noise ratio, and improve sensitivity Effect

Active Publication Date: 2020-11-13
WEIFANG GOERTEK MICROELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In the related art, the air volume in the rear chamber of the microphone structure is small, and it is more difficult to push the movement of the silicon diaphragm, which leads to a decrease in the sensitivity of the MEMS sensor, which in turn leads to a decrease in the signal-to-noise ratio of the microphone structure, and the air volume in the front chamber is large, and the resonance frequency will decrease. , affecting the frequency response performance of the microphone structure

Method used

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  • Microphone structure and electronic device

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Embodiment Construction

[0034] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0035] It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of the present invention are only used to explain the relationship between the components in a certain posture (as shown in the figure). Relative positional relationship, movement conditions, etc., if the specific posture changes, the directional indication will also change accordingly.

[0036] At the same time, the meaning of...

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Abstract

The invention discloses a microphone structure and an electronic device, the microphone structure comprises a packaging shell, an elastic structure and a detection structure, the packaging shell is provided with an accommodating cavity, and the packaging shell is provided with a sound inlet hole communicated with the accommodating cavity; the elastic structure is arranged in the accommodating cavity and is arranged corresponding to the sound inlet hole; and the detection structure is arranged in the accommodating cavity, is electrically connected with the packaging shell, and is used for transmitting a signal to the elastic structure and receiving a signal reflected by the elastic structure. The invention aims to improve the sensitivity of the microphone structure so as to increase the signal-to-noise ratio of the microphone structure and avoid the influence on the frequency response performance of the microphone structure.

Description

technical field [0001] The invention relates to the technical field of microphones, in particular to a microphone structure and electronic equipment using the microphone structure. Background technique [0002] MEMS (Micro-Electro-Mechanical System, Micro-Electro-Mechanical System) technology is a high-tech that has developed rapidly in recent years. It uses advanced semiconductor manufacturing technology to realize batch manufacturing of sensors, drivers and other devices. Compared with the corresponding traditional devices , MEMS devices have very obvious advantages in terms of volume, power consumption, weight and price. In the market, the main application examples of MEMS devices include pressure sensors, accelerometers and microphone structures. [0003] Microphone structure, also known as MEMS microphone, is a microphone based on MEMS technology. The structure of the microphone can convert the sound pressure change into a capacitance change, and then the ASIC chip re...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R19/04
CPCH04R19/04H04R2201/003
Inventor 解士翔
Owner WEIFANG GOERTEK MICROELECTRONICS CO LTD