Mobile communication circuit board and manufacturing method thereof

Abstract

The invention discloses a mobile communication circuit board and a manufacturing method thereof, relates to the technical field of circuit boards, and aims at solving the problem that an existing mobile communication circuit board is single in structure and poor in functionality. One side of a first protective frame body is provided with a second protective frame body; fixing lugs are arranged onthe two sides of the first protective frame body and the two sides of the second protective frame body correspondingly; inserting plates are arranged at one end of the second protective frame body; the number of the inserting plates is two; sliding blocks are arranged on the inner wall of the second protective frame body; the number of the sliding blocks is two; clamping blocks are arranged in thefirst protective frame body and the second protective frame body; the number of the clamping blocks is two; clamping grooves are formed in the inner walls of the two clamping blocks; a circuit boardmain body is arranged in the clamping grooves; a first motor is arranged at the front end of the first protective frame body; two fixing bases are arranged on one side of the first motor; and a lead screw is arranged between the two fixing bases.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a mobile communication circuit board and a manufacturing method thereof. Background technique [0002] With the continuous development of science and technology, electronic devices commonly used by people, such as mobile phones, computers, PADs, etc., have also developed in two directions: large capacity, multi-function and high-speed, high-frequency transmission, which also promotes the development of circuit board manufacturing technology to high-density In order to meet the development needs of electronic equipment in the direction of large capacity and multi-function, the wiring density of circuit boards is getting higher and higher, and more and more electronic devices need to be accommodated, and in order to obtain better In order to improve the user experience, electronic equipment is also required to be thinner and lighter. In order to meet the above requirements, ...

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Problems solved by technology

[0004] The purpose of the present invention is to provide a mobile communication circuit board and its manufacturing method, to solve the problem that the existing mobile communication circuit board has a single structure and poor functionality in the above-mentioned background technology

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