A semiconductor silicon wafer polishing machine

Abstract

The invention relates to the technical field of polishing equipment, and discloses a semiconductor silicon wafer polishing machine, which includes a machine base and a polishing disc. The polishing disc is located directly above the middle of the top surface of the machine base. The middle part of the bottom surface of the optical disc is fixedly equipped with a silicon wafer fixture, and the top of the middle part of the base is provided with a polishing groove, the inner ring of the polishing groove is movably socketed with the outer ring of the polishing pad, and the inside of the base is fixed at the bottom of the polishing groove. A double-axis motor is installed, and a fixed ring magnet is fixedly installed on the top of the inside of the base and at the position of the outer ring of the polishing pad. There is a movable ring magnet located directly above the fixed ring magnet, and a ring-shaped sponge ring groove is opened inside the top of the base, and a water-absorbing sponge is fixedly installed at the bottom of the sponge ring groove. Through these settings, the polishing effect can be improved , while ensuring the utilization of the polishing fluid.

Description

technical field [0001] The invention relates to the technical field of polishing equipment, in particular to a semiconductor silicon wafer polishing machine. Background technique [0002] Silicon wafer 16 is a kind of semiconductor material. Silicon wafer 16 needs to be processed in various processes during production, among which polishing is a one-step operation near the end. The smooth and flat silicon wafer 16 is polished by a polishing machine that uses a polishing pad and a polishing liquid to polish the surface of the silicon wafer 16. The polishing machine is easy to use, but there are still some problems in practice: [0003] 1. During polishing, since the polishing pad plane and the polishing area of ​​the machine base are in the same plane, and the hydration film formed on the bottom of the silicon wafer 16 is actually polished during polishing, the liquid level of the polishing liquid is also low In this way, the polishing liquid will be driven to rotate during ...

AI Technical Summary

Problems solved by technology

[0003] 1. During polishing, since the polishing pad plane and the polishing area of ​​the machine base are in the same plane, and the hydration film formed on the bottom of the silicon wafer 16 is actually polished during polishing, the liquid level of the polishing liquid is also low In this way, the polishing liquid will be driven to rotate during the rotary polishing, and the polishing liquid close to the outer ring of the hydration film will sag downward due to the centrifugal force, resulting in insufficient polishing liquid at the polishing site, thus affecting the polishing effect. The polishing liquid will also be thrown out to the surrounding under the action of centrifugal force, which not only wastes but also causes pollution;

[0004] 2. When the polishing liquid is polished with the polishing pad, the polishing liquid needs to be dripped continuously, and the small particles after polishing are taken away by the fluidity of the polishing liquid. It will be very expensive to use the polishing liquid continuously, and it is impossible to The polishing situation controls the increase of the polishing liquid, which will lead to a part of the waste of the polishing liquid, which is not conducive to production

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