Flexible circuit board side wall interconnection process
A flexible circuit board, circuit board technology, applied in the direction of circuits, electrical components, electrical solid devices, etc., can solve the problems of no change, the soldering area should not be too large, and the area of BGA or LGA is not considered, so as to achieve the reduction of area Effect
Active Publication Date: 2020-11-17
浙江集迈科微电子有限公司
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Problems solved by technology
[0003]
However, this interconnection process only considers the redistribution of the solder pins of the chip, but does not take into account the area occupied by BGA or LGA on the PCB, but there is almost no change.
As the size of the chip becomes smaller, the terminal is also facing a similar trend. Either the terminal is directly miniaturized, or the chip on the terminal is denser and has more functions. This requires that the soldering area of the chip on the terminal PCB should not be too large. Obviously, the current fan-out process cannot solve this problem
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Embodiment 1
[0045] A flexible circuit board side wall interconnection process, which includes the following steps:
[0046] Such as Figure 1~3 as shown,
[0047] (a), provide the first silicon wafer, form a plurality of first TSV holes on the upper surface of the first silicon wafer, and form the first groove and the second groove on the upper surface of the first silicon wafer, and then form the first silicon wafer on the first silicon wafer A first passivation layer is formed on the upper surface, and at least one first seed layer is formed on the first passivation layer; metal is electroplated on the first seed layer, so that the metal fills the first TSV hole, the first groove and the second concave groove, polishing and removing the metal on the upper surface of the first silicon wafer, and forming RDL and metal pads on the upper surface of the first silicon wafer;
[0048] Such as figure 1 As shown, the first TSV hole is made on the surface of the first silicon wafer 102 by photol...
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The invention provides a flexible circuit board side wall interconnection process. The flexible circuit board side wall interconnection process comprises the following steps: forming an RDL and a metal bonding pad on the upper surface of a first silicon wafer; forming an RDL and a metal bonding pad on the lower surface of the first silicon wafer to obtain a first adapter plate; forming a fifth groove in the upper surface of the second silicon wafer; forming an RDL and a metal bonding pad on the lower surface of the second silicon wafer to obtain a second adapter plate; bonding the first adapter plate and the second adapter plate to obtain a multi-layer interconnection plate, and arranging a sixth groove; providing a third silicon wafer, forming RDL and micro bumps on the surface of the third silicon wafer, and leading out the PAD; providing a first circuit board solder ball, flattening the first circuit board solder ball to obtain a second circuit board, and welding and interconnectingthe third silicon wafer and the second circuit board to obtain a chip with a flexible circuit board; and embedding the chip into the sixth groove, interconnecting the bonding pads, fixing the chip, and forming an RDL and the bonding pads on the surface of the chip. According to the flexible circuit board side wall interconnection process, the area of the PCB is reduced.
Description
technical field [0001] The invention relates to the technical field of semiconductors, in particular to a side wall interconnection process of a flexible circuit board. Background technique [0002] The semiconductor industry is developing rapidly. With the popularization of 5nm process, the size of artificial intelligence chips and microprocessor chips is getting smaller and smaller, but there are more and more chip interconnection pads. In order to enable chips to be interconnected with PCB boards, traditional The packaging method generally uses the FAN-OUT method or the fan-out method of the adapter board for soldering, and the dense PAD is fanned out to a larger area through the interconnection wire, and then connected to the PCB through BGA solder balls or LGA pins. board fixed. [0003] However, this interconnection process only considers the redistribution of the solder pins of the chip, but does not take into account the area occupied by the BGA or LGA on the PCB, b...
Claims
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IPC IPC(8): H01L21/768H01L21/683
CPCH01L21/76898H01L21/76895H01L21/6835H01L2221/68359
Inventor 高群冯光建黄雷蔡永清
Owner 浙江集迈科微电子有限公司