Preparation process for anti-static film used for electronic products

An antistatic film and preparation technology, applied in the direction of conductive coatings, coatings, polyurea/polyurethane coatings, etc., can solve the problems of product uncertainty risk, large humidity change range, unstable antistatic performance, etc., to reduce damage chance, small change in surface resistance, and stable anti-static performance

Active Publication Date: 2020-11-24
ZHEJIANG OUREN NEW MATERIALS CO LTD
View PDF3 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The existing antistatic film is greatly affected by the ambient humidity, and its antistatic performance is unstable. Therefore, due to the large range of humidity changes in the process or use environment of electronic products coated with antistatic film, it brings uncertainty to the product. risks of

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Preparation process for anti-static film used for electronic products
  • Preparation process for anti-static film used for electronic products
  • Preparation process for anti-static film used for electronic products

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1~4

[0021] Embodiments 1 to 4: A preparation process for an antistatic film for electronic products, the antistatic film comprising a substrate layer 1 and an antistatic coating 2 positioned on the surface of the substrate layer 1;

[0022] The antistatic coating 2 is obtained by drying the coating solution, which is composed of the following components, as shown in Table 1:

[0023] Table 1

[0024] ;

Embodiment 1

[0025] In Example 1, the antioxidant is selected from antioxidant 1010, the above-mentioned leveling agent is selected from leveling agent 440, the above-mentioned substrate layer 1 is a PET layer, the thickness of the above-mentioned substrate layer 1 is 50 μm, and the above-mentioned first antistatic coating 2 and the second antistatic coating 3 both have a thickness of 6 μm.

Embodiment 2

[0026] In Example 2, the antioxidant is selected from antioxidant 1024, the above-mentioned leveling agent is selected from the leveling agent DC57, the above-mentioned substrate layer 1 is a TPU layer, the thickness of the above-mentioned substrate layer 1 is 50 μm, and the above-mentioned first antistatic coating 2 and the second antistatic coating 3 both have a thickness of 6 μm.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
Login to view more

Abstract

The invention discloses a preparation process for an anti-static film used for electronic products. The preparation process comprises the following steps: step I, mixing and evenly stirring 100 partsof polyurethane resin, 40-60 parts of polyvinyl alcohol, 2-4 parts of sodium octyl sulfate, 1-3 parts of sodium 3-(N-ethyl-3-methylanilino)propanesulfonate, 8-12 parts of dioctyl terephthalate, 40-60parts of n-butyl alcohol, 20-30 parts of isobutyl acetate, 0.5-1 part of castor oil polyoxyethylene ether, 0.3-0.8 part of triethylenetetramine, 0.5-1.5 parts of silane coupling agent, 0.6-2 parts ofantioxidant and 0.4-1 part of leveling agent to obtain a coating solution; and step II, uniformly applying the coating solution obtained in step I onto a substrate layer (1) through coating, and performing baking and drying to obtain the anti-static film. Not only is the anti-static performance of the anti-static film prepared by the preparation process improved, but also the change of the surfaceresistance of the anti-static film is almost very small, and the anti-static performance is stable under the condition that the change of the anti-static performance is relatively large under the influence of environment humidity, and accordingly, the anti-static film is suitable for the complex electronic product process flow and climate.

Description

technical field [0001] The invention belongs to the technical field of protective films, and in particular relates to a preparation process of an antistatic film. Background technique [0002] Electronic devices need to be lighter, thinner and shorter, and the power density of electrical operations needs to be continuously improved. The application occasions of these electronic products generally have anti-static requirements, because the existence of static electricity not only makes the product surface easy to absorb dust, but also affects the circuit. Accuracy, or lead to circuit breakdown in the process of electronic product processing, making the product invalid. Therefore, it is necessary to do electrostatic protection treatment on the protective film. [0003] The existing antistatic film is greatly affected by the ambient humidity, and its antistatic performance is unstable. Therefore, due to the large range of humidity changes in the process or use environment of e...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): C08J7/044C09D175/04C09D129/04C09D5/24C09D7/48C08L67/02C08L75/04C08L27/06
CPCC09D175/04C09D5/24C09D7/48C08J2367/02C08J2375/04C08J2327/06C08J2475/04C08L2201/04C08L2205/03C08L29/04C08L71/02C08K5/54C08K5/1345
Inventor 涂大记杨晓明潘华
Owner ZHEJIANG OUREN NEW MATERIALS CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap