Semiconductor lead frame punch forming product discharging, stacking and transferring device

Abstract

The invention discloses a semiconductor lead frame punch forming product discharging, stacking and transferring device. The semiconductor lead frame punch forming product discharging, stacking and transferring device comprises a bearing mechanism, a lifting mechanism and a transferring mechanism, wherein the bearing mechanism comprises a pair of spacing-adjustable limiting plates, a first L-shapedbearing plate and a second L-shaped bearing plate, and the first L-shaped bearing plate and the second L-shaped bearing plate are oppositely arranged at an interval between the limiting plates; the lifting mechanism is connected with the first L-shaped bearing plate and the second L-shaped bearing plate and used for driving the first L-shaped bearing plate and the second L-shaped bearing plate toascend and descend; and the conveying direction of the transferring mechanism is perpendicular to the conveying direction of a discharging conveying crawler belt, the transferring mechanism comprisesa rotating roller and a plurality of conveying belts arranged on the rotating roller at intervals, and the first L-shaped bearing plate and the second L-shaped bearing plate are located at the intervals of the pair of adjacent conveying belts correspondingly. According to the device, stamped and formed lead frames can be stacked in order, the influence of a height difference at the moment when adischarged material is separated from a conveying crawler belt on the lead frames is avoided, slow descending stacking is achieved, and the lead frames stacked to the designated height can be conveyedto the rear stage in order after being stacked in order.

Description

technical field [0001] The invention relates to the field of semiconductor components, in particular to a device for stacking and transferring semiconductor lead frame stamped products. Background technique [0002] Lead frame is an important carrier of semiconductor devices and integrated circuit modules. In the preparation of this type of device / module, the required wafer / chip is usually fixed on the designated area of ​​the lead frame by means of bonding, etc., and electrical conduction is achieved by bonding gold wires or setting jumpers, and then packaged. Plastic base, and corresponding cutting, punching, folding, etc. to obtain products. [0003] In the preparation of the lead frame, it is necessary to use a mold to perform stamping or pressing of different shapes on the designated areas of the lead frame, so as to obtain the finished lead frame. Usually, after the lead frame is formed, it is sent out by the crawler conveyor mechanism, and then the material is simpl...

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